Abstract: A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.

Abstract: A sensor chip breaking strength inspection apparatus that performs sensor chip breaking strength inspection on a semiconductor wafer on which a plurality of sensor chips having a diaphragm portion are disposed includes: a stage on which the semiconductor wafer is mounted; and a nozzle that emits a medium onto the sensor chips at a pressure equivalent to a standard breaking strength of the sensor chips.

Abstract: A first rectangular groove having a rectangular cross section and a second rectangular groove substantially orthogonal to the first rectangular groove and having a rectangular cross section are formed in a first silicon substrate. A third rectangular groove located at a position facing the first rectangular groove and having a rectangular cross section is formed on a second silicon substrate. A device substrate including a frequency conversion device is provided in the second rectangular groove, so that the frequency conversion device is located where the first and second rectangular grooves are orthogonal to each other.

Abstract: A reflection type liquid crystal display is formed by an interlayer insulating film having appropriate unevenness of an inseparable pattern in a picture element region and having a contact hole of a separable pattern on a drain electrode of a TFT is formed by plainly applying a photosensitive insulating resin so that it may dissolve difference in level caused by a gate electrode wiring, source electrode wiring, and the TFT, and conducting exposure and development while changing exposure amount. The exposure of the insulating resin is conducted through divisional exposure in which the inseparable pattern and the separable pattern are arranged on different masks, and the inseparable pattern is exposed by a predetermined exposure amount of 20 to 80% of an exposure amount for the separable pattern.

Abstract: A first narrow rectangular groove having a rectangular cross section and a second narrow rectangular groove substantially orthogonal to the first narrow rectangular groove and having a rectangular cross section are formed in a first silicon substrate. A third narrow rectangular groove located at a position facing the first narrow rectangular groove and having a rectangular cross section is formed on a second silicon substrate. A device substrate including a frequency conversion device is provided in the second narrow rectangular groove, so that the frequency conversion device is located where the first and second narrow rectangular grooves are orthogonal to each other.

Abstract: A silicon device includes an insulating substrate having a recess on the surface of the substrate, and a beam-like structure made of silicon on the front surface of the insulating substrate, surrounds the recess. The beam-like structure includes at least one functional section having a supporting section bonded to the insulating substrate and at least one cantilever integral with the supporting section and extending across the recess. The silicon device also includes a frame made of silicon surrounding and spaced from the beam-like structure and on the insulating substrate. The silicon device also includes a conductive film having electrical continuity with the frame and on the surface of the insulating substrate, at least in a portion directly opposite the cantilever. The conductive film prevents the insulating substrate from being charged, thereby significantly suppressing damage of the beam-like structure during dry etching.

Abstract: An inertia force sensor with a damper. The damper includes a cantilever for a movable part disposed in a movable electrode protruding therefrom, and a cantilever for a fixed part disposed in a support portion for the movable part or a support portion for the fixed part and protruding therefrom. The damper allows the cantilever for the movable part and the cantilever for the fixed part to contact each other before the movable electrode contacts the support portion for the movable part and the support portion for the fixed part. As a result, it is possible to prevent a stopper from being damaged and to improve the reliability of the sensor.

Abstract: An inertia force sensor of the invention is provided with a damper portion. The damper portion includes a cantilever for a movable part disposed in a movable electrode portion so as to protrude therefrom and a cantilever for a fixed part disposed in a support portion for the movable part or a support portion for the fixed part so as to protrude therefrom. The damper portion is formed so that the cantilever for the movable part and the cantilever for the fixed part contact each other before the movable electrode portion contacts the support portion for the movable part and the support portion for the fixed part. As a result, it is possible to prevent a stopper portion from being damaged and improve the reliability of the sensor.

Abstract: A silicon device including an insulating substrate having a recess formed on the surface thereof, and a beam-like structure made of silicon formed on the front surface of the insulating substrate to surround the recess. The beam-like structure includes at least one functional section having a supporting section bonded onto the insulating substrate and at least one cantilever formed integrally with the supporting section while extending across the recess. The silicon device also includes a frame made of silicon that surrounds the beam-like structure with a space kept therefrom and is formed onto the insulating substrate. The silicon device also includes a conductive film having electrical continuity with the frame and formed on the surface of the insulating substrate at least in a portion right below the cantilever. The conductive film prevents the insulating substrate from being charged thereby significantly suppressing the damage caused on the beam-like structure during dry etching.

Abstract: To provide a method of producing a TFT array and a liquid crystal display apparatus in which a contact resistivity of a pixel electrode and a drain electrode through a contact hole in an interlayer insulating film can be not more than 10E4&OHgr; stably.

Abstract: A magnetic head suspension according to the present disclosure includes a protrusion provided at the center of a flexure for mounting and supporting a magnetic head slider or on the tip end of a load beam for exerting a given load on the magnetic head slider such that the tip end of the protrusion is a support point, further including a fixing section for fixing said flexure on the tip end of said load beam and a magnetic head slider mounting section separated from said fixing section through a stepped portion.

Abstract: A magnetic disk recorder which applies an azimuth recording system and which can use all of the tracks of a magnetic disk. In particular, a plurality of magnetic head chips, each of which is formed with a head gap having a predetermined azimuth angle, are respectively assembled into separate head sliders along with dummy heads, and the head sliders are driven by separate actuators.