Patents by Inventor Muneki AKAZAWA

Muneki AKAZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin film forming method, semiconductor substrate and electronic device produced by employing same
    Patent number: 9343576
    Abstract: The present invention provides a thin film forming method. The method includes the steps of: providing a first substrate, of which a surface is covered with a thin film; forming a plurality of openings through the thin film; forming a hollow portion between the first substrate and the thin film by etching the first substrate through the openings; bringing the thin film into contact with a second substrate with a liquid interposed between the thin film and the second substrate; and heating the first substrate and/or the second substrate. In the step of heating, the liquid interposed between the thin film and the second substrate evaporates off, which results in that the thin film is separated from the first substrate and transferred onto the second substrate.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: May 17, 2016
    Assignee: Hiroshima University
    Inventors: Seiichiro Higashi, Kohei Sakaike, Yoshitaka Kobayashi, Shogo Nakamura, Muneki Akazawa
  • THIN FILM FORMING METHOD, SEMICONDUCTOR SUBSTRATE AND ELECTRONIC DEVICE PRODUCED BY EMPLOYING SAME
    Publication number: 20150349137
    Abstract: The present invention provides a thin film forming method. The method includes the steps of: providing a first substrate, of which a surface is covered with a thin film; forming a plurality of openings through the thin film; forming a hollow portion between the first substrate and the thin film by etching the first substrate through the openings; bringing the thin film into contact with a second substrate with a liquid interposed between the thin film and the second substrate; and heating the first substrate and/or the second substrate. In the step of heating, the liquid interposed between the thin film and the second substrate evaporates off, which results in that the thin film is separated from the first substrate and transferred onto the second substrate.
    Type: Application
    Filed: August 7, 2015
    Publication date: December 3, 2015
    Inventors: Seiichiro HIGASHI, Kohei SAKAIKE, Yoshitaka KOBAYASHI, Shogo NAKAMURA, Muneki AKAZAWA