Patents by Inventor Munenori Iwami

Munenori Iwami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9612205
    Abstract: According to one embodiment, an etching amount measurement pattern is provided in a surface of a substrate. The pattern comprises a plurality of components two-dimensionally disposed and causing light incident on the pattern to be diffracted, A configuration of the component has 4-fold rotational symmetry. The plurality of components is arranged in a disposition having 4-fold rotational symmetry.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: April 4, 2017
    Assignee: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Ganachev IvanPetrov, Munenori Iwami
  • Patent number: 9330948
    Abstract: A heater unit according to an embodiment includes: a flat heater including a linear heating element arranged in a planar pattern; a first mesh body formed in a mesh pattern using a material with high heat conductivity and placed at least on one side of the flat heater facing the flat heater; and a second mesh body formed in a mesh pattern using a material with lower heat conductivity than that of the first mesh body and placed to face a surface of the first mesh body opposite to the surface of the first mesh body facing the flat heater.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: May 3, 2016
    Assignees: SHIBAURA MECHATRONICS CORPORATION, KABUSHIKI KAISHA TOSHIBA
    Inventors: Masaaki Furuya, Munenori Iwami, Takahiko Wakatsuki, Masanori Kondo, Katsuya Yamada
  • Publication number: 20150062578
    Abstract: According to one embodiment, an etching amount measurement pattern is provided in a surface of a substrate. The pattern comprises a plurality of components two-dimensionally disposed and causing light incident on the pattern to be diffracted, A configuration of the component has 4-fold rotational symmetry. The plurality of components is arranged in a disposition having 4-fold rotational symmetry.
    Type: Application
    Filed: August 20, 2014
    Publication date: March 5, 2015
    Inventors: Ganachev IvanPetrov, Munenori Iwami
  • Patent number: 8475870
    Abstract: A resin layer formation method and device for making a resin layer uniform on a substrate before lamination or on a substrate is provided. Adhesive is coated at an inner circumference side while rotating a substrate at low speed. A first adhesive layer is formed on the surface of the substrate by rotating at high speed. A step difference section is formed around a rotation center of the substrate by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer to hardening the area. Adhesive is coated at the rotation center side from the step difference section on the substrate, and a second adhesive layer is formed on the first adhesive layer by rotating the substrate at high speed. The first adhesive layer and the second adhesive layer are integrated to form a uniform adhesive layer.
    Type: Grant
    Filed: December 2, 2011
    Date of Patent: July 2, 2013
    Assignee: Shibaura Mechatronics Corporation
    Inventors: Tomokazu Ito, Hisashi Nishigaki, Tsukasa Kawakami, Haruka Narita, Yoji Takizawa, Takumi Hanada, Munenori Iwami
  • Publication number: 20120325797
    Abstract: A heater unit according to an embodiment includes: a flat heater including a linear heating element arranged in a planar pattern; a first mesh body formed in a mesh pattern using a material with high heat conductivity and placed at least on one side of the flat heater facing the flat heater; and a second mesh body formed in a mesh pattern using a material with lower heat conductivity than that of the first mesh body and placed to face a surface of the first mesh body opposite to the surface of the first mesh body facing the flat heater.
    Type: Application
    Filed: June 21, 2012
    Publication date: December 27, 2012
    Applicants: Kabushiki Kaisha Toshiba, Shibaura Mechatronics Corporation
    Inventors: Masaaki FURUYA, Munenori IWAMI, Takahiko WAKATSUKI, Masanori Kondo, Katsuya YAMADA
  • Patent number: 8220410
    Abstract: A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer AL1 is formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer AL1 and hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer AL2 is formed on the first adhesive layer AL1 by rotating the substrate P at high speed. The first adhesive layer AL1 and the second adhesive layer AL2 are integrated to form a uniform adhesive layer B as a whole.
    Type: Grant
    Filed: July 13, 2010
    Date of Patent: July 17, 2012
    Assignee: Shibaura Mechatronics Corporation
    Inventors: Tomokazu Ito, Hisashi Nishigaki, Tsukasa Kawakami, Haruka Narita, Yoji Takizawa, Takumi Hanada, Munenori Iwami
  • Publication number: 20120076947
    Abstract: A resin layer formation method and device for making a resin layer uniform on a substrate before lamination or on a substrate is provided. Adhesive is coated at an inner circumference side while rotating a substrate at low speed. A first adhesive layer is formed on the surface of the substrate by rotating at high speed. A step difference section is formed around a rotation center of the substrate by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer to hardening the area. Adhesive is coated at the rotation center side from the step difference section on the substrate, and a second adhesive layer is formed on the first adhesive layer by rotating the substrate at high speed. The first adhesive layer and the second adhesive layer are integrated to form a uniform adhesive layer.
    Type: Application
    Filed: December 2, 2011
    Publication date: March 29, 2012
    Inventors: Tomokazu Ito, Hisashi Nishigaki, Tsukasa Kawakami, Haruka Narita, Yoji Takizawa, Takumi Hanada, Munenori Iwami
  • Patent number: 8088438
    Abstract: A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer AL1 is formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer AL1 and hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer AL2 is formed on the first adhesive layer AL1 by rotating the substrate P at high speed. The first adhesive layer AL1 and the second adhesive layer AL2 are integrated to form a uniform adhesive layer B as a whole.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: January 3, 2012
    Assignee: Shibaura Mechatronics Corporation
    Inventors: Tomokazu Ito, Hisashi Nishigaki, Tsukasa Kawakami, Haruka Narita, Yoji Takizawa, Takumi Hanada, Munenori Iwami
  • Publication number: 20100275840
    Abstract: A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer AL1 is formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer AL1 and hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer AL2 is formed on the first adhesive layer AL1 by rotating the substrate P at high speed. The first adhesive layer AL1 and the second adhesive layer AL2 are integrated to form a uniform adhesive layer B as a whole.
    Type: Application
    Filed: July 13, 2010
    Publication date: November 4, 2010
    Inventors: Tomokazu Ito, Hisashi Nishigaki, Tsukasa Kawakami, Haruka Narita, Yoji Takizawa, Takumi Hanada, Munenori Iwami
  • Publication number: 20080206570
    Abstract: A resin layer formation method, resin layer formation device, disk and disk manufacturing method for making a resin layer uniform on a substrate before lamination or on a substrate to be coated by a simple procedure are provided. Adhesive A is coated at the inner circumference side while rotating a substrate P at low speed, a first adhesive layer AL1 is formed on the surface of the substrate P by rotating the substrate P at high speed, a step difference section H is formed around a rotation center of the substrate P by irradiating ultraviolet on an area in the inner circumference side of the first adhesive layer AL1 and hardening the area, the adhesive A is coated at the rotation center side from the step difference section H on the substrate P, and a second adhesive layer AL2 is formed on the first adhesive layer AL1 by rotating the substrate P at high speed. The first adhesive layer AL1 and the second adhesive layer AL2 are integrated to form a uniform adhesive layer B as a whole.
    Type: Application
    Filed: June 1, 2005
    Publication date: August 28, 2008
    Inventors: Tomokazu Ito, Hisashi Nishigaki, Tsukasa Kawakami, Haruka Narita, Yoji Takizawa, Takumi Hanada, Munenori Iwami
  • Publication number: 20040223284
    Abstract: There is disclosed an electrostatic attracting method in which a direct-current voltage is applied to an electrode disposed at a table formed of a dielectric material to attract/hold a substrate onto a holding surface of the table with an electrostatic force produced thereby, the method comprising a first step of applying a voltage having a predetermined polarity to the electrode to charge the holding surface with an electric charge having a polarity different from that applied to the electrode, a second step of holding the substrate in contact with the holding surface to prevent electric charges charged on the holding surface from disappearing, and a third step of applying a voltage having a polarity different from that applied in the first step to the electrode in a state in which the substrate contacts the holding surface to produce an electric charge having the same polarity as that charged at the holding surface in the first step on the holding surface of the table, and attracting/holding the substrate w
    Type: Application
    Filed: December 2, 2003
    Publication date: November 11, 2004
    Applicant: Shibaura Mechatronics Corporation
    Inventors: Munenori Iwami, Noboru Kuriyama, Koji Takeishi, Ikuo Hayafuji, Hirokazu Masuda
  • Patent number: 4693777
    Abstract: An apparatus for producing semiconductor devices in which a plurality of treatment chambers such as a load chamber, an etching chamber, a sputtering chamber, an ion implantation chamber, a CVD chamber, an unload chamber, a transfer chamber, a heat-treatment chamber, a rinsing chamber and the like, are connected in series preferably in the form of U for effecting various treatments of semiconductor wafers. Wafer conveyor and transfer means are provided to move a wafer through the treatment chambers in which the wafer is normally sequentially processed and these conveyor and transfer means are reversible so that a wafer which has been moved into a predetermined treatment chamber can be returned to the inlet of the apparatus, whereby the quantity of dust attached to the wafer in each treatment chamber can be easily and positively detected.
    Type: Grant
    Filed: November 27, 1985
    Date of Patent: September 15, 1987
    Assignees: Kabushiki Kaisha Toshiba, Kabushiki Kaisha Tokuda Seisakusho
    Inventors: Shigeki Hazano, Masahiro Shibagaki, Hidetaka Jyo, Reiichiro Sensui, Munenori Iwami, Noboru Suzuki