Abstract: A mounting structure includes a member to be bonded, a flexible base, a reinforcing portion, and a bonding member. The flexible base includes a plurality of first leads. The reinforcing portion is arranged between an edge of the flexible base and an outer lead of the plurality of first leads and has a width larger than that of the outer lead. The bonding member bonds the member to be bonded and the flexible base together.

Abstract: An electro-optical device includes an electro-optical panel including a first substrate and a second substrate which interpose an electro-optical material therebetween, a transparent conductive film disposed on an outer surface of the first substrate or the second substrate, and a base member having an electrode electrically connected to the transparent conductive film via an adhesive, in which the electrode is formed at a region having a plane shape, which is the same as or narrower than that of the base member, the base member is provided with concave portions or through-holes disposed along a side thereof, and the concave portions or the through-holes are provided with the adhesive.

Abstract: An electro-optical device includes an electro-optical panel including a first substrate and a second substrate which interpose an electro-optical material therebetween, a transparent conductive film disposed on an outer surface of the first substrate or the second substrate, and a base member having an electrode electrically connected to the transparent conductive film via an adhesive, in which the electrode is formed at a region having a plane shape, which is the same as or narrower than that of the base member, the base member is provided with concave portions or through-holes disposed along a side thereof, and the concave portions or the through-holes are provided with the adhesive.

Abstract: A method of manufacturing an electronic component mounting body is used for mounting an IC chip having a bumps as an external mounting terminal on a base material made of thermoplastic resin, comprising: a bump burying step of burying the bumps into the base material by heating and pressing the IC chip toward the base material to expose a portion of the bumps to a base material surface on the opposite side of the IC chip, and a step of forming a conductor conductively connected to the bump by arranging conductive material on the base material surface to which the portion of the bumps are exposed.

Abstract: A mounting structure includes a member to be bonded, a flexible base, a reinforcing portion, and a bonding member. The flexible base includes a plurality of first leads. The reinforcing portion is arranged between an edge of the flexible base and an outer lead of the plurality of first leads and has a width larger than that of the outer lead. The bonding member bonds the member to be bonded and the flexible base together.

Abstract: A method of manufacturing an electronic component mounting body is used for mounting an IC chip having a bumps as an external mounting terminal on a base material made of thermoplastic resin, comprising: a bump burying step of burying the bumps into the base material by heating and pressing the IC chip toward the base material to expose a portion of the bumps to a base material surface on the opposite side of the IC chip, and a step of forming a conductor conductively connected to the bump by arranging conductive material on the base material surface to which the portion of the bumps are exposed.

Abstract: The first and second electronic components are disposed so that a first X axis and a second X axis coincide with each other and a first Y axis and a second Y axis coincide with each other. The first and second electronic components are moved in directions, in which a first point and a second point approach each other, and along the first and second Y axes by an approximated distance between the first and second points.

Abstract: The first and second electronic components are disposed so that a first X axis and a second X axis coincide with each other and a first Y axis and a second Y axis coincide with each other. The first and second electronic components are moved in directions, in which a first point and a second point approach each other, and along the first and second Y axes by an approximated distance between the first and second points.

Abstract: A semiconductor device comprises an electrically insulating film having a device hole; a plurality of groups of leads, each group including of a large number of leads arranged in a predetermined pattern, in a plurality of lead formation regions on the surface of the film; an integrated circuit chip positioned within the device hole and with electrodes connected to inner lead portions of the leads; and a resin sealing portion that seals in at least the integrated circuit chip, the film, and the lead groups. The film comprises a first group of aperture portions including of aperture portions provided in regions outside the lead formation regions and a second group of aperture portions consisting of a plurality of aperture portions provided in the lead formation regions.

Abstract: A semiconductor device comprises an electrically insulating film having a device hole; a plurality of groups of leads, each group including of a large number of leads arranged in a predetermined pattern, in a plurality of lead formation regions on the surface of the film; an integrated circuit chip positioned within the device hole and with electrodes connected to inner lead portions of the leads; and a resin sealing portion that seals in at least the integrated circuit chip, the film, and the lead groups. The film comprises a first group of aperture portions including of aperture portions provided in regions outside the lead formation regions and a second group of aperture portions consisting of a plurality of aperture portions provided in the lead formation regions.