Abstract: A deposition-preventing part, particularly a masking tool, which is used over an area to be protected from adhesion of a physical vapor deposition film, for physical vapor deposition apparatuses which are used to form physical vapor deposition films of metals, particularly noble metals, on CD-ROM, CD-R or CD-E substrates. One or more of a solder-plated Cu wire, a solder-plated Cu foil tape, an Al foil tape and a synthetic resin tape are attached, in a peelable manner, on a solder film formed on the surface of the substrate of a deposition-preventing part such as a masking tool, which has a surface roughness of 0.01-1 .mu.m when expressed as the arithmetic mean roughness defined according to JIS B 0601, a thickness of 5-100 .mu.m and a melting point of 100-450.degree. C.

Abstract: A sputtering target is disclosed which includes a backing member of a cylindrical shape and a target material bonded onto an outer peripheral surface of the backing member by hot isostatic pressing. A method for manufacturing a sputtering target is also disclosed. First, a cylindrical backing member is inserted into a mold such that a space is defined between the backing member and the mold. A target material is then filled into the space between the backing member and the mold, and the mold is sealed. Thereafter, the target material and the backing member are subjected to hot isostatic pressing.

Abstract: The present invention relates to a target unit including a basic body and a target layer mainly comprising Si alloy disposed on an outer peripheral surface of the basic body by a hard-facing method. A target unit in accordance with the present invention has an interposed layer between a basic body and a target layer, in which one side thereof is strongly attached to a peripheral surface of the basic body, while other side thereof is strongly attached to an inner surface of the target layer. Also, a method in accordance with the present invention comprises the steps of: preparing a basic body in the form of a cylinder; applying an interposed layer on a peripheral surface of said basic body by means of hard-facing; and further applying a target layer on a peripheral surface of said interposed layer by means of hard-facing.