Abstract: An electrical connector (25) includes a stamped receptacle contact (15) crimped to a wire (17) and fitted into a plastic housing (30) having an interior lance (39) operable to lock the contact within the housing to receive a tab terminal contact inserted within the receptacle contact. A locking part (40) of a thin, flat plastic configuration is inserted within the housing (15) from the front (31), latched therein in a first position allowing contact insertion from the rear (32) of said housing and in a second position wedging the interior lance against displacement to provide a double locking of said contact; projections (43, 44) on the part (40) cooperating with projections (49, 52) on the interior of the housing in latching of said part relative to said housing in the first and second positions.

Abstract: This invention relates to a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate, its production method and an electronic device using the former. The present invention is particularly useful for connecting electrically a plurality of chips, for which an absorption function of the difference of thermal expansion in a horizontal direction and capability of displacement in a vertical direction are requisite, to a substrate. Moreover, the connecting structure of the present invention can simplify the fabrication process, has high reliability and can be applied to high performance electronic appliances and apparatuses such as electronic computers.

Abstract: Disclosed is a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate and a method of manufacturing the same. The present invention is suitable especially for electrical connection between a plurality of chips and a substrate which is required to have a function of absorbing a difference in thermal expansion in the horizontal direction and to deform in the vertical direction, and characterized in that a conductive flat spring having a height not more than the minimum length in the lateral direction is provided between the electronic part such as a chip and a wires substrate.

Abstract: In connecting an electronic circuit part such as a semiconductor or other part to a substrate for mounting the part with solder, the solder is composed of a high-melting-point solder portion which is subjected to working such as rolling and heat treatment in order to break the cast structure thereof, and a smaller volume of low-melting-point solder portions. The high-melting-point solder portion is connected to both the electronic circuit substrate and the electronic circuit part through the low-point-melting solder portions.This method enables interconnection between objects to be connected without impairing the high ductility and toughness of the high-melting-point solder which is subjected to working and heat treatment. This soldering method ensures highly reliable manufacture of miniaturized high density circuits, such as LSI.