Abstract: An optical module according to one embodiment includes: an optical element having a first side, a second side, and a third side; a housing; a thermoelectric cooler with the optical element being mounted on the thermoelectric cooler; a driving circuit arranged on the side of the first side of the optical element; a first bonding pad arranged on the side of the second side of the optical element; and a first wiring pattern provided on the frame body of the housing and connected to the first bonding pad of the optical element through the first bonding wiring, wherein the thermoelectric cooler has a plurality of Peltier elements arranged with spacings. A spacing between the plurality of Peltier elements located on the side of the second side is narrower than a spacing between the plurality of Peltier elements located in the center of the optical element.

Abstract: An optical module according to one embodiment includes: a beam splitter having a first surface, a second surface facing the first surface, a third surface intersecting with the first surface, a fourth surface facing the third surface, and an inner surface formed within a region defined by the first surface, the second surface, the third surface, and the fourth surface; and a light receiving unit arranged at a position facing the third surface of the beam splitter. The beam splitter splits first incident light incident from the first surface into first split light transmitted through the inner surface and emitted from the second surface and second split light reflected on the inner surface and emitted from the third surface. The optical module includes a light absorbing/reflecting unit provided on the fourth surface.

Abstract: An optical module according to one embodiment includes a package having an opening surrounded by side walls, and a lid mounted on the package to seal the opening. The lid has a plate-like shape and includes a welded portion fixed by welding to an upper surface of the side wall of the package having the opening formed thereon, an easily deformable portion formed at a position separated from the welded portion and deformed along with the welding, and a central portion having a flat shape.

Abstract: A manufacturing method of an optical module including a package and lid, the package having an opening to be sealed with the lid. The manufacturing method includes placing the lid on the package so that the lid covers the opening; putting a metal block on the lid, the metal block having a first surface touching a top surface of the lid; welding the lid to the package using a seam welding machine, the first surface of the metal block touching the top surface of the lid during the welding, the metal block being configured not to interfere the seam welding machine; and detaching the metal block from the lid.

Abstract: A bonding device includes an irradiator that irradiates a surface of a first component with ultraviolet rays, and a conveyor that conveys the first component, wherein the irradiator irradiates the first component held by the conveyor with the ultraviolet ray, and the conveyor conveys the first component irradiated with the ultraviolet rays to a surface of a second component, and brings the surface of the first component and the surface of the second component into contact with each other to bond the first component and the second component.

Abstract: A photo receiver includes a photo detector including a semiconductor substrate having a first main surface and a second main surface and a metal pattern layer provided on the second main surface; and a carrier including a supporting substrate having a third main surface facing the second main surface and a solder pattern layer provided on the third main surface. The solder pattern layer is bonded to the metal pattern layer. The first main surface is provided with a variable optical attenuator, an optical 90-degree hybrid device, and a plurality of photodiodes optically coupled to the variable optical attenuator via the optical 90-degree hybrid device. The solder pattern layer and the metal pattern layer are located in a peripheral area surrounding a central area where the variable optical attenuator and the optical 90-degree hybrid device are located when viewed in the normal direction of the first main surface.

Abstract: The optical module includes an optical separating element. The optical separating element includes a birefringent material and has a first face and a second face. The first face is configured to receive a signal light and a LO light. The signal light includes a first polarized light and a second polarized light. The first polarized light travels from the first face to the second face in a first direction and is emitted from a first emission spot on the second face. The second polarized light travels from the first face to the second face in a second direction and is emitted from a second emission spot on the second face. The LO light travels from the first face to the second face in the first direction and is emitted from a LO light emission spot which is located between the first emission spot and the second emission spot.

Abstract: An optical module includes a base plate, a carrier, an optical semiconductor device, an optical lens component, and a transmissive resin member in a cured state disposed between the optical semiconductor device and the optical lens component. The optical semiconductor device has an optical end surface, and emits an outgoing beam from the optical end surface or receives an incoming beam at the optical end surface. The optical lens component has a first lens surface and a second lens surface, the first lens surface facing the optical end surface of the optical semiconductor device, the first lens surface being provided between the optical end surface and the second lens surface. The transmissive resin contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.

Abstract: A coherent receiver comprising: a signal port receiving the signal light that has two polarization components at right angles each other; a polarization dependent beam splitter (PBS) that splits the signal light into two portions depending on the polarizations contained in the signal light; a beam splitter (BS) that splits the local light into two portions; a multi-mode interference (MMI) device that interferes between one of the two portions of the signal light and one of the two portions of the local light; optical components provided between the PBS and the MMI device; and wherein the PBS splitting a first wavelength range of the signal light and a second wavelength range outside the first wavelength range.

Abstract: An optical module includes a base having a first surface, a board having a second surface and a third surface, an optical circuit element having a fourth surface, a fifth surface and two ports, and an array lens. The first surface is joined to the second surface by a first solder. The third surface has a first metallic pattern and a second metallic pattern that are joined to the fourth surface by a second solder. The array lens is fixed onto the first surface of the base so as to be optically coupled to the two ports provided at one end of the optical circuit element in the first direction. The first metallic pattern is formed closer than the second metallic pattern to the one end of the optical circuit element in the first direction and is formed between the two ports in the second direction.

Abstract: An optical transmitter module includes a semiconductor laser device, optical modulator, temperature adjusting device which includes a substrate, a first installation part and a second installation part, a package having a bottom surface opposite to a back surface of the substrate, the package housing the semiconductor laser device, the optical modulator, and the temperature adjusting device; and a middle block disposed between a first temperature controlling element a the second temperature controlling element, the middle block having a back surface directly or indirectly fastened to a principal surface of the substrate.

Abstract: An optical module includes a base plate, a carrier, an optical semiconductor device, an optical lens component, and a transmissive resin member in a cured state disposed between the optical semiconductor device and the optical lens component. The optical semiconductor device has an optical end surface, and emits an outgoing beam from the optical end surface or receives an incoming beam at the optical end surface. The optical lens component has a first lens surface and a second lens surface, the first lens surface facing the optical end surface of the optical semiconductor device, the first lens surface being provided between the optical end surface and the second lens surface. The transmissive resin contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.

Abstract: An optical module includes a base having a first surface, a board having a second surface and a third surface, an optical circuit element having a fourth surface, a fifth surface and two ports, and an array lens. The first surface is joined to the second surface by a first solder. The third surface has a first metallic pattern and a second metallic pattern that are joined to the fourth surface by a second solder. The array lens is fixed onto the first surface of the base so as to be optically coupled to the two ports provided at one end of the optical circuit element in the first direction. The first metallic pattern is formed closer than the second metallic pattern to the one end of the optical circuit element in the first direction and is formed between the two ports in the second direction.

Abstract: An optical transmitter module includes a semiconductor laser device, optical modulator, temperature adjusting device which includes a substrate, a first installation part and a second installation part, a package having a bottom surface opposite to a back surface of the substrate, the package housing the semiconductor laser device, the optical modulator, and the temperature adjusting device; and a middle block disposed between a first temperature controlling element a the second temperature controlling element, the middle block having a back surface directly or indirectly fastened to a principal surface of the substrate.

Abstract: A photo receiver includes a photo detector including a semiconductor substrate having a first main surface and a second main surface and a metal pattern layer provided on the second main surface; and a carrier including a supporting substrate having a third main surface facing the second main surface and a solder pattern layer provided on the third main surface. The solder pattern layer is bonded to the metal pattern layer. The first main surface is provided with a variable optical attenuator, an optical 90-degree hybrid device, and a plurality of photodiodes optically coupled to the variable optical attenuator via the optical 90-degree hybrid device. The solder pattern layer and the metal pattern layer are located in a peripheral area surrounding a central area where the variable optical attenuator and the optical 90-degree hybrid device are located when viewed in the normal direction of the first main surface.

Abstract: The optical module includes an optical separating element. The optical separating element includes a birefringent material and has a first face and a second face. The first face is configured to receive a signal light and a LO light. The signal light includes a first polarized light and a second polarized light. The first polarized light travels from the first face to the second face in a first direction and is emitted from a first emission spot on the second face. The second polarized light travels from the first face to the second face in a second direction and is emitted from a second emission spot on the second face. The LO light travels from the first face to the second face in the first direction and is emitted from a LO light emission spot which is located between the first emission spot and the second emission spot.

Abstract: An optical module that includes a shell, an optical fiber, a coupling portion, and a ferrule is disclosed. The shell installs an optical device, for instance, a multi-mode interference (MMI) device therein. The optical fiber in a tip thereof is optically coupled with the optical device within the shell. The coupling portion has a cylindrical shape with a bore having an axis and secures the optical fiber, where the coupling portion is attached to the shell. The ferrule, which is secured in the coupling portion, has a pillared shape with a diameter that is slightly smaller than a diameter of the bore of the coupling portion. The ferrule has a groove that receives and secures the optical fiber therein. The filler fills the groove and fixes the optical fiber in the groove.

Abstract: The receiver including a package, first and second optical fibers, a capillary, and an array lens is disclosed. The first fiber has a first edge coupling to a MMI device by propagating a signal beam. The second fiber has a second edge coupling to the MMI device by propagating a local beam. The array lens has first and second lenses. The first lens converts the signal beam into a collimating beam, and the second lens converts the local beam into a collimating beam. The capillary has an edge opposite to the array lens, and the edge has a first region including the first edge and a second region including the second edge. The first edge is slanted to a first axis, and the second edge is slanted to a second axis, and a direction of the first edge and a direction of the second edge are different each other.

Abstract: A coherent receiver comprising: a signal port receiving the signal light that has two polarization components at right angles each other; a polarization dependent beam splitter (PBS) that splits the signal light into two portions depending on the polarizations contained in the signal light; a beam splitter (BS) that splits the local light into two portions; a multi-mode interference (MMI) device that interferes between one of the two portions of the signal light and one of the two portions of the local light; optical components provided between the PBS and the MMI device; and wherein the PBS splitting a first wavelength range of the signal light and a second wavelength range outside the first wavelength range.

Abstract: The receiver including a package, first and second optical fibers, a capillary, and an array lens is disclosed. The first fiber has a first edge coupling to a MMI device by propagating a signal beam. The second fiber has a second edge coupling to the MMI device by propagating a local beam. The array lens has first and second lenses. The first lens converts the signal beam into a collimating beam, and the second lens converts the local beam into a collimating beam. The capillary has an edge opposite to the array lens, and the edge has a first region including the first edge and a second region including the second edge. The first edge is slanted to a first axis, and the second edge is slanted to a second axis, and a direction of the first edge and a direction of the second edge are different each other.