Abstract: A photosensitive resin composition which comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator and (C) an acrylate monomer and may further comprise (D) a methacrylate monomer, wherein the acrylate monomer (C) comprises (C1) an acrylate monomer having a double bond equivalent of not less than 250 and (C2) azo acrylate monomer having a double bond equivalent of not more than 150, the content of the methacrylate monomer (D) is 0 to 5 mass %, the content of the acrylate monomer having a double bond equivalent of not less than 250 (C1) is 40 to 60 mass %, and the content of the acrylate monomer having a double bond equivalent of not more than 150 (C2) is 40 to 60 mass % based on the acrylate monomer (C), and the content of the photopolymerization initiator (B) is 0.5 to 1.5 mass % based on the photosensitive resin composition, and an etching method and plating method using the above photosensitive resin composition.

Abstract: The present invention is a photosensitive resin composition to be used in an etching process in which an etching treatment is conducted with an etching solution containing hydrofluoric acid or ammonium fluoride. The photosensitive resin composition comprises at least (A) an acid-modified epoxy acrylate, (B) a photopolymerization initiator, (C) a blocked isocyanate compound, and (D) a filler. The etching process involves forming a photosensitive resin layer comprising said photosensitive resin composition, on at least one surface of a substrate; exposing and then developing the photosensitive resin layer; baking the photosensitive layer; and conducting an etching treatment with an etching solution containing hydrofluoric acid or ammonium fluoride.

Abstract: A photosensitive resin composition which comprises (A) an alkali-soluble resin, (B) a photopolymerization initiator and (C) an acrylate monomer and may further comprise (D) a methacrylate monomer, wherein the acrylate monomer (C) comprises (C1) an acrylate monomer having a double bond equivalent of not less than 250 and (C2) azo acrylate monomer having a double bond equivalent of not more than 150, the content of the methacrylate monomer (D) is 0 to 5 mass %, the content of the acrylate monomer having a double bond equivalent of not less than 250 (C1) is 40 to 60 mass %, and the content of the acrylate monomer having a double bond equivalent of not more than 150 (C2) is 40 to 60 mass % based on the acrylate monomer (C), and the content of the photopolymerization initiator (B) is 0.5 to 1.5 mass % based on the photosensitive resin composition, and an etching method and plating method using the above photosensitive resin composition.

Abstract: The present invention is a photosensitive resin composition to be used in an etching process in which an etching treatment is conducted with an etching solution containing hydrofluoric acid or ammonium fluoride. The photosensitive resin composition comprises at least (A) an acid-modified epoxy acrylate, (B) a photopolymerization initiator, (C) a blocked isocyanate compound, and (D) a filler. The etching process involves forming a photosensitive resin layer comprising said photosensitive resin composition, on at least one surface of a substrate; exposing and then developing the photosensitive resin layer; baking the photosensitive layer; and conducting an etching treatment with an etching solution containing hydrofluoric acid or ammonium fluoride.

Abstract: A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a?) forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b?) treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etc

Abstract: There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.

Abstract: A method for forming a conductor pattern comprising the steps of (a) forming a photo-crosslinkable resin layer on a substrate provided with a conductive layer on its surface, (b) treating the photo-crosslinkable resin layer with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etching, the steps included in this order, said alkali aqueous solution being an aqueous solution containing 5 to 20 mass % of an inorganic alkaline compound, or method for forming a conductor pattern comprising the steps of (a?) forming a photo-crosslinkable resin layer on a substrate provide with a conductive layer on its surface and inside a hole thereof, (i) curing the photo-crosslinkable resin layer on the hole alone or on the hole and a surrounding area thereof, (b?) treating the photo-crosslinkable resin layer in an uncured portion with an alkali aqueous solution to render it thinner, (c) carrying out exposure for a circuit pattern, (d) developing and (e) etc

Abstract: As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on th

Abstract: There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a resist pattern, comprising the steps of forming a resin layer and a mask layer on a first surface of a substrate having a through-hole(s), and removing the resin layer on the through-hole(s) and on a periphery of the through-hole(s) on the first surface by supplying a resin layer removing solution from a second surface opposite to the first surface of the substrate, and a method for producing a circuit board using the method for forming a resist pattern, and a circuit board.

Abstract: The method for making a screen printing mask, provided by this invention is a method for making a resin-formed screen printing mask having a resin layer on one main surface of a screen printing mask having openings, a resin layer having openings nearly in the same locations as those of said openings of the screen printing mask, and comprises the step of coating the one main surface of said screen printing mask with the resin layer by laminating, and the step of removing those parts of said resin layer which are positioned nearly in the same locations as those of the openings of said screen printing mask by self-alignment, to form the openings through the resin layer.

Abstract: As means for solving a problem of a positional shift of a land and a hole which is caused by an alignment in the formation of an etching resist layer and a plated resist layer in a method of manufacturing a circuit board, there are provided a method of manufacturing a circuit board including the steps of forming a first resin layer on a surface of an insulating substrate having a conductive layer on the surface and an internal wall of a through hole or/and a non-through hole, forming a second resin layer which is insoluble or slightly soluble in a developing solution for the first resin layer on the first resin layer provided on the surface conductive layer, and removing the first resin layer provided over the hole with the developing solution for the first resin layer, and a method of manufacturing a circuit board including the step of uniformly charging a surface of the first resin layer to induce a potential difference to the first resin layer provided over the hole and the first resin layer provided on th

Abstract: Disclosed is disclosed a process for producing a printed wiring board which comprises the steps of: a) exposing a wiring board having at least one photoconductive layer in which its chargeability is changed by light exposure on at least one surface of a conductive support which comprises an insulating substrate and at least one metal conductive layer provided at least one surface thereof through a resist pattern; b) charging the photoconductive layer to form an electrostatic latent image; c) forming a toner image on the photoconductive layer by toner developing treatment; d) removing a portion of the photoconductive layer to which no toner is attached by dissolution to form a resist image; and e) removing a portion of the metal conductive layer other than a portion where the resist image is formed by etching.

Abstract: There is disclosed a liquid developing method of a printed wiring board using a one-surface stepwise developing system which forms a resist pattern stepwisely according to an electrophotographic reverse developing method on each surface of a material to be developed obtained by forming photo-conductive layers on both surfaces of a both-surfaces copper-clad laminated board, wherein the method comprises the steps of subjecting to a static charging treatment on a surface to which no electrostatic latent image is formed which surface is positioned opposing to an electrostatic latent image-formed surface which is a surface to be exposed, or to a non-developing surface between completion of an exposure treatment and before a liquid toner developing treatment, and subjecting to the liquid toner developing treatment to form a toner image corresponding to the resist pattern on the electrostatically latent image-formed surface.

Abstract: Disclosed is disclosed a process for producing a printed wiring board which comprises the steps of: