Abstract: A distributed constant filter includes a resonator that is not grounded and a first ground electrode. The first ground electrode faces the resonator in a first direction (Z). The resonator is a distributed constant line resonator. The resonator includes a plurality of distributed constant lines and a via conductor. The plurality of distributed constant lines are arranged in layers in the first direction (Z). The via conductor extends in the first direction (Z). Each of the plurality of distributed constant lines is connected to the via conductor only at one end portion of both end portions of the distributed constant line.

Abstract: A dielectric resonator includes a dielectric substrate, a distributed element, and a shield conductor portion. The distributed element extends in the X-axis direction inside the dielectric substrate. The shield conductor portion is on a surface of the dielectric substrate and winds around the distributed element when the distributed element is viewed from the X-axis direction in plan view. One end of the distributed element is not connected to the shield conductor portion. The distributed element includes a plurality of conductors.

Abstract: An electronic circuit module includes a circuit board, electronic components, an embedding layer, and a conductive film. The circuit board has a first principal surface, a second principal surface and a side surface, and includes a pattern conductor and a via conductor. The conductive film is connected to a conduction path to a ground electrode. The side surface includes a first region, a second region having a longer circumferential length than the first region, and a connection region connecting the first region and the second regions. The conductive film is formed on a region including at least part of each of an outer surface of the embedding layer, the first region, and the connection region. The conductive film formed on at least part of the connection region is connected to an exposed portion in the connection region of the via conductor included in the conduction path to the ground electrode.

Abstract: An electronic circuit module includes a circuit board, electronic components, an embedding layer, and a conductive film. The circuit board has a first principal surface, a second principal surface and a side surface, and includes a pattern conductor and a via conductor. The conductive film is connected to a conduction path to a ground electrode. The side surface includes a first region, a second region having a longer circumferential length than the first region, and a connection region connecting the first region and the second regions. The conductive film is formed on a region including at least part of each of an outer surface of the embedding layer, the first region, and the connection region. The conductive film formed on at least part of the connection region is connected to an exposed portion in the connection region of the via conductor included in the conduction path to the ground electrode.

Abstract: A high-frequency module includes port electrodes defining external connection terminals provided on a multilayer body including dielectric layers. A first port electrode is connected to an antenna. A plurality of port electrodes other than the first port electrode are respectively connected to communication systems supporting respective frequency bands. The first port electrode is connected to the plurality of other port electrodes through a plurality of switch elements. A first group of the plurality of switch elements and a second group of the plurality of switch elements are not connected to each other within a switch circuit and are connectable to each other through a common terminal outside of the switch circuit. As a result, a high-frequency module that allows a design change to be made using the same switch circuit without changing the switch circuit is provided.

Abstract: A high frequency module is configured to be compatible with a cellular phone with a plurality of specifications without increasing the number of ports in a switching device. The high frequency module includes a switching device and a module board. The switching device includes a common port and connection switch ports. The module board includes external connection ports and a third filter circuit. An external connection port is connected to one of the connection switch ports of the switching device via a transmission line inside the module board. The third filter circuit is connected to a second external connection port and a third external connection port independently from the device connection ports of the switching device.

Abstract: A high frequency switch module includes a multilayer substrate and a switch IC. The switch IC is mounted on a top plane of the multilayer substrate. A drive power signal input port and control signal input ports are connected to direct current external input ports through direct current voltage conductors, respectively. In-layer conductors of the direct current voltage conductors are arranged so that the in-layer conductors overlap each other at least partially in a state in which the multilayer substrate is viewed along a stacking direction.

Abstract: A high frequency module is configured to be compatible with a cellular phone with a plurality of specifications without increasing the number of ports in a switching device. The high frequency module includes a switching device and a module board. The switching device includes a common port and connection switch ports. The module board includes external connection ports and a third filter circuit. An external connection port is connected to one of the connection switch ports of the switching device via a transmission line inside the module board. The third filter circuit is connected to a second external connection port and a third external connection port independently from the device connection ports of the switching device.

Abstract: A high frequency switch module includes a multilayer substrate and a switch IC. The switch IC is mounted on a top plane of the multilayer substrate. A drive power signal input port and control signal input ports are connected to direct current external input ports through direct current voltage conductors, respectively. In-layer conductors of the direct current voltage conductors are arranged so that the in-layer conductors overlap each other at least partially in a state in which the multilayer substrate is viewed along a stacking direction.

Abstract: A high-frequency module includes port electrodes defining external connection terminals provided on a multilayer body including dielectric layers. A first port electrode is connected to an antenna. A plurality of port electrodes other than the first port electrode are respectively connected to communication systems supporting respective frequency bands. The first port electrode is connected to the plurality of other port electrodes through a plurality of switch elements. A first group of the plurality of switch elements and a second group of the plurality of switch elements are not connected to each other within a switch circuit and are connectable to each other through a common terminal outside of the switch circuit. As a result, a high-frequency module that allows a design change to be made using the same switch circuit without changing the switch circuit is provided.

Abstract: A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.

Abstract: A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.

Abstract: A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.