Patents by Inventor Muneyuki Haruki

Muneyuki Haruki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board
    Patent number: 4677252
    Abstract: A circuit board comprises a rigid metal substrate, a conductive metal layer formed into a predetermined circuit pattern, and a resinous layer interposed between the metal substrate and the metal layer for electrically insulating and bonding the metal substrate and the metal layer, the conductive metal layer having an elongation at break of not less than 15%, and the resinous layer comprising a first resinous layer having a volume resistivity of not less than 10.sup.10 .OMEGA.. cm, and a second resinous layer having an elongation at break of not less than 100%. The circuit board has a desired dielectric strength between the metal substrate and the conductive metal layer and can be bent without resulting disconnection in the metal layer or the like.
    Type: Grant
    Filed: November 18, 1986
    Date of Patent: June 30, 1987
    Assignee: Sony Corporation
    Inventors: Satoshi Takahashi, Akira Tsutsumi, Junji Suzuki, Hiroshi Kumakura, Takao Ito, Kenji Ohsawa, Yuji Ikegami, Muneyuki Haruki, Nobuyuki Yasuda, Masayuki Ohta