Patents by Inventor Muneyuki OOSHIMA

Muneyuki OOSHIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic circuit device
    Patent number: 10070529
    Abstract: A surface-mount component (10A) having a pair of connection terminals (12a, 12b) with an inter-terminal pitch L2 therebetween is mounted on a circuit substrate (20A) having a pair of electrode pads (22a, 22b) with an inter-electrode pitch L1 therebetween (L2>L1). Standard position indication marks (23) are formed on the circuit substrate (20A). When heating is performed under a state in which solder non-wetting of the left electrode pad (22a) occurs, the solder applied to the right electrode pad (22b) solder connects the right electrode pad (22b) and the connection terminal (12b), and the surface-mount component (10A) is attracted to the left and is offset or displaced from the standard position indication marks (23) by an offset dimension ?7. If the solder is applied to the left and right electrode pads (22a, 22b), there is no offset dimension.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: September 4, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Eitaro Fukuzumi, Mitsunori Nishida, Muneyuki Ooshima
  • ELECTRONIC CIRCUIT DEVICE
    Publication number: 20170208689
    Abstract: A surface-mount component (10A) having a pair of connection terminals (12a, 12b) with an inter-terminal pitch L2 therebetween is mounted on a circuit substrate (20A) having a pair of electrode pads (22a, 22b) with an inter-electrode pitch L1 therebetween (L2>L1). Standard position indication marks (23) are formed on the circuit substrate (20A). When heating is performed under a state in which solder non-wetting of the left electrode pad (22a) occurs, the solder applied to the right electrode pad (22b) solder connects the right electrode pad (22b) and the connection terminal (12b), and the surface-mount component (10A) is attracted to the left and is offset or displaced from the standard position indication marks (23) by an offset dimension ?7. If the solder is applied to the left and right electrode pads (22a, 22b), there is no offset dimension.
    Type: Application
    Filed: August 5, 2016
    Publication date: July 20, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Eitaro FUKUZUMI, Mitsunori NISHIDA, Muneyuki OOSHIMA