Abstract: Disclosed are a video processing method and a device therefor. The video processing method may include receiving a video comprising a plurality of temporal portions, receiving a first model parameter corresponding to a first neural network to process the video entirely, receiving residues between the first model parameter and a plurality of second model parameters corresponding to a plurality of second neural networks to process the plurality of temporal portions, and performing at least one of super-resolution, reverse or inverse tone mapping, tone mapping, frame interpolation, motion deblurring, denoising, and compression artifact removal on the video based on the residues.

Abstract: An independent steering control system includes independent steering systems steer wheels and a controller configured for determining a level of fault of each of the independent steering systems. When at least one independent steering system among the independent steering systems is determined to be completely unsteerable, the controller is configured to perform fault tolerant steering by changing steering angles of remaining independent steering systems among the independent steering systems determined to be normal.

Abstract: A battery system includes a plurality of battery containers, each including a battery rack, a container housing accommodating the battery rack in an internal space, and a first power line configured to transmit charge power and discharge power, wherein the first power lines of the battery containers are connected to each other, and a control cabinet including a control module configured to control the plurality of battery containers, a cabinet housing accommodating the control module in an internal space, and a second power line configured to be connected to the first power line of one of the plurality of battery containers.

Abstract: A water injection unit includes an enclosure including, on at least one outer wall, a connection port connectable to a fire-fighting connection hose or a communication cable, a water tank connected to the connection port and located in the enclosure, a gas storage tank connected to the water tank to supply gas into the water tank, and a controller connected to the connection port and the gas storage tank, and configured to detect whether a fire occurs in the battery container, and allow gas in the gas storage tank to be sprayed into the water tank and allow fire extinguishing water in the water tank to be discharged due to gas pressure.

Abstract: An energy storage system includes a control container configured to be connected to an external power conversion system (PCS) and an external electrical system; and a battery container including at least one battery rack and configured to be connected to the control container.

Abstract: An energy storage system according to an aspect of the present disclosure includes a control container having a battery system controller (BSC), a master controller connected to the BSC through a first communication line, and a bank battery management system (BBMS) connected to the BSC through a second communication line; and a battery container including a slave controller connected to the master controller through the first communication line, and a rack battery management system (RBMS) connected to the BBMS through the second communication line and for monitoring a state of a corresponding battery rack.

Abstract: A blue light cut film including a diazaporphyrin-based compound of Chemical Formula 1, having absorption in a 380 nm to 450 nm range, and having a main absorption peak in a 560 nm to 600 nm range, wherein the main absorption peak has a full width at half the peak maximum of 30 nm or less.

Abstract: A battery container has excellent workability, assembly, expandability, and safety. The battery container includes at least one battery rack including a plurality of battery modules; a container housing having an empty space formed therein to accommodate the battery rack; a plurality of main connectors located on at least one side of the container housing and configured to be electrically connected to the outside; and a main bus bar connected between the plurality of main connectors to transmit power.

Abstract: A system for diagnosing and analyzing infrastructure, comprising: a storage unit storing a diagnostic script, which is for collecting system information from a target system or at least one target operating server of the target system; a script transmission unit transmitting the diagnostic script to the target system to diagnose the target system; a system information collection unit receiving the system information from the target system or the at least one target operating server as a result of the running of the diagnostic script; an analysis engine storage unit storing at least one analysis rule corresponding to the target system or the at least one target operating server; and an analysis information generation unit analyzing the system information by using the analysis rule, and generating analysis information regarding the target system and the at least one target operating server based on the results of the analyzing.

Abstract: A system for diagnosing and analyzing infrastructure, comprising: a storage unit storing a diagnostic script, which is for collecting system information from a target system or at least one target operating server of the target system; a script transmission unit transmitting the diagnostic script to the target system to diagnose the target system; a system information collection unit receiving the system information from the target system or the at least one target operating server as a result of the running of the diagnostic script; an analysis engine storage unit storing at least one analysis rule corresponding to the target system or the at least one target operating server; and an analysis information generation unit analyzing the system information by using the analysis rule, and generating analysis information regarding the target system and the at least one target operating server based on the results of the analyzing.

Abstract: An image sensor according to an example embodiment of includes a first pixel and a second pixel in a first row. The first pixel includes a first photoelectric conversion element at a first depth in a semiconductor substrate and the first photoelectric conversion element is configured to convert a first visible light spectrum into a first photo charge, and the second pixel includes a second photoelectric conversion element at a second depth from the first depth in the semiconductor substrate, the second photoelectric conversion element is at least partially overlapped by the first photoelectric conversion element in a vertical direction, and the second photoelectric conversion element is configured to convert a second visible light spectrum into a second photo charge.

Abstract: An image sensor according to an example embodiment of includes a first pixel and a second pixel in a first row. The first pixel includes a first photoelectric conversion element at a first depth in a semiconductor substrate and the first photoelectric conversion element is configured to convert a first visible light spectrum into a first photo charge, and the second pixel includes a second photoelectric conversion element at a second depth from the first depth in the semiconductor substrate, the second photoelectric conversion element is at least partially overlapped by the first photoelectric conversion element in a vertical direction, and the second photoelectric conversion element is configured to convert a second visible light spectrum into a second photo charge.

Abstract: A back side illumination image sensor according to an embodiment includes: a device isolation region and a pixel region that are on a front side of a first substrate; a light sensor and a readout circuit that are on the pixel region; an interlayer dielectric layer and a metal line that are on the front side of the first substrate; a second substrate that is bonded to the front side of the first substrate on which the metal line is formed; a pixel isolating dielectric layer that is on the device isolation region at a back side of the first substrate; and a microlens that is on the light sensor at the back side of the first substrate.

Abstract: A back side illumination image sensor according to an embodiment includes: a photosensitive device and a readout circuit on the front side of a first substrate; an interlayer dielectric layer on the front side of the first substrate; a metal line on the interlayer dielectric layer; a pad having a step on the interlayer dielectric layer; and a second substrate bonded with the front side of the first substrate over the interlayer dielectric layer, metal line, and pad.

Abstract: Disclosed are a back side illumination image sensor and a method for manufacturing the same. The back side illumination image sensor includes an isolation region and a pixel area on a front side of a first substrate; a photo detector and a readout circuitry on the pixel area; an interlayer dielectric layer and a metal line on the front side of the first substrate; a second substrate bonded to the front side of the first substrate formed with the metal line; a pixel division ion implantation layer on the isolation region at a back side of the first substrate; and a micro-lens on the photo detector at the back side of the first substrate.

Abstract: A method of manufacturing a back side illumination image sensor according to an embodiment includes: forming an ion implantation layer by implanting ions throughout the front side of a first substrate; defining a pixel region by forming a device isolation region on the front side of the first substrate; forming a photosensitive device and a readout circuit on the pixel region; forming an interlayer dielectric layer and a metal line on the front side of the first substrate; bonding a second substrate with the front side of the first substrate where the metal line is formed; removing a lower part of the first substrate under the ion implantation layer; applying wet etching to a back side of the first substrate after removing the lower part; and forming a microlens on the photosensitive device at the back side of the first substrate.

Abstract: A display device is disclosed. A display device includes a connecting block (40) rotatably fastened to an end of a stand assembly (20); a head mount (43) vertically movable with respect to the connecting block (40); and a locking unit that selectively locks the motion of the head mount (43) as the connecting block (40) rotates.

Abstract: A method of manufacturing a back side illumination image sensor is provided. The method can include forming an ion implantation layer in a front side of a first substrate, forming a photodetector and a readout circuit on the first substrate, forming an interlayer dielectric layer and a metal line on the front side of the first substrate, bonding a second substrate with the front side of the first substrate, removing a lower portion of the first substrate on the basis of the ion implantation layer, performing an annealing process with respect on a back side of the first substrate, and forming a microlens over the photodetector.

Abstract: A method of manufacturing a back side illumination image sensor is provided. The method can include forming an ion implantation layer in a front side of a first substrate, forming a photodetector and a readout circuit on the first substrate, forming an interlayer dielectric layer and a metal line on the front side of the first substrate, bonding a second substrate with the front side of the first substrate, removing a lower portion of the first substrate on the basis of the ion implantation layer, performing an annealing process with respect on a back side of the first substrate, and forming a microlens over the photodetector.

Abstract: Disclosed are a back side illumination image sensor and a method for manufacturing the same. The back side illumination image sensor includes an isolation region and a pixel area on a front side of a first substrate; a photo detector and a readout circuitry on the pixel area; an interlayer dielectric layer and a metal line on the front side of the first substrate; a second substrate bonded to the front side of the first substrate formed with the metal line; a pixel division ion implantation layer on the isolation region at a back side of the first substrate; and a micro-lens on the photo detector at the back side of the first substrate.