Patents by Inventor Munju GOH
Munju GOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11186776Abstract: The present disclosure relates to a high thermal conductive polymer composite, comprising: a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group, wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.Type: GrantFiled: August 13, 2019Date of Patent: November 30, 2021Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Hong Jin Lim, Nam Ho You, Seokhoon Ahn, Munju Goh, Se Gyu Jang, Myung Jong Kim
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Patent number: 10975307Abstract: Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.Type: GrantFiled: January 9, 2018Date of Patent: April 13, 2021Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Munju Goh, Hyeonuk Yeo, Nam Ho You, Se Gyu Jang, Seokhoon Ahn, Young Soo Kim
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Publication number: 20200056094Abstract: The present disclosure relates to a high thermal conductive polymer composite, comprising: a liquid crystalline resin comprising a mesogen and at least one linear polymerization reactive group, wherein the liquid crystalline resin is cured with a linear polymerization initiator and includes a molecular structure aligned in at least one direction.Type: ApplicationFiled: August 13, 2019Publication date: February 20, 2020Inventors: Hong Jin LIM, Nam Ho YOU, Seokhoon AHN, Munju GOH, Se Gyu JANG, Myung Jong KIM
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Patent number: 10280534Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1?m?8 and n is a number satisfying 1?n?6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.Type: GrantFiled: September 10, 2018Date of Patent: May 7, 2019Assignee: Korea Institute of Science and TechnologyInventors: Munju Goh, Bon-Cheol Ku, Nam Ho You, Sang Jun Youn, Hyeonuk Yeo
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Publication number: 20190010631Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1?m?8 and n is a number satisfying 1?n?6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at a temperature of 200° C., specifically 100° C. or lower, and to reduce processing cost and energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.Type: ApplicationFiled: September 10, 2018Publication date: January 10, 2019Applicant: Korea Institute of Science and TechnologyInventors: Munju GOH, Bon-Cheol KU, Nam Ho YOU, Sang Jun YOUN, Hyeonuk YEO
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Patent number: 10106421Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.Type: GrantFiled: December 15, 2016Date of Patent: October 23, 2018Assignee: Korea Institute of Science and TechnologyInventors: Munju Goh, Nam Ho You, Hyeonuk Yeo, Bon-Cheol Ku, Sang Jun Youn, Jin Won Yu, Jin Jung
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Patent number: 10059593Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.Type: GrantFiled: December 15, 2016Date of Patent: August 28, 2018Assignee: Korea Institute of Science and TechnologyInventors: Munju Goh, Nam Ho You, Hyeonuk Yeo, Bon-Cheol Ku, Sang Jun Youn, Jin Won Yu, Jin Jung
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Publication number: 20180201835Abstract: Disclosed is a liquid crystalline epoxy compound wherein an epoxy group is positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage. Since the liquid crystalline epoxy compound includes an epoxy group positioned at a side chain of the longer direction of a mesogen group and each of the mesogen group and the epoxy group is connected to the center of the molecular structure through a flexible linkage, the interaction between the mesogens in a cured resin product occurs significantly without weakening even after curing, thereby improving the heat conductivity of the resin compound through the active heat transfer between the mesogens.Type: ApplicationFiled: January 9, 2018Publication date: July 19, 2018Inventors: Munju GOH, Hyeonuk YEO, Nam Ho YOU, Se Gyu JANG, Seokhoon AHN, Young Soo KIM
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Publication number: 20180194918Abstract: Disclosed are a method and an apparatus for repairing composite materials using a solvation process, in which, in the repair of composite materials comprising a matrix resin and a filler fiber, a solution capable of depolymerizing the matrix resin is provided to a portion to be repaired of the composite material to depolymerize the matrix resin. By removing the matrix resin constituting the composite material by solvating it with a solvent while leaving the internal filler fibers, it is possible to secure continuity of the fiber skeleton of the composite material even after the repair, perform very easy repair, and minimize damage to the fiber skeleton.Type: ApplicationFiled: January 9, 2018Publication date: July 12, 2018Inventors: Munju GOH, Jun Kyung KIM, Chiyoung PARK, NAM HO YOU, Hyeonuk YEO
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Transparent and heat-insulating material including polymer capsule and method for preparing the same
Patent number: 9950340Abstract: Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.Type: GrantFiled: October 21, 2014Date of Patent: April 24, 2018Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Munju Goh, Nam Ho You, Hyeonuk Yeo, Young Bum Hong -
Publication number: 20170174523Abstract: For depolymerization of a cured epoxy resin material, used is a composition including a transition metal salt or a transition metal oxide containing a transition metal element (metal element that belongs to Groups 3-12 in the Periodic Table). In the reaction solvent, an oxidation occurs by the medium of the transition metal element so that the cured epoxy resin material may be depolymerized and decomposed. In this manner, it is possible to carry out depolymerization of a cured epoxy resin material at a temperature of 200° C., specifically 100° C. or lower very simply and rapidly, and to reduce the processing cost and energy requirement.Type: ApplicationFiled: December 15, 2016Publication date: June 22, 2017Applicant: Korea Institute of Science and TechnologyInventors: Munju GOH, Nam Ho YOU, Hyeonuk YEO, Bon-Cheol KU, Sang Jun YOUN, Jin Won YU, Jin JUNG
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Publication number: 20170165876Abstract: Disclosed are a method and an apparatus for recovering a fiber assembly by decomposing a thermosetting resin composite material, such as carbon fiber reinforced plastic (CFRP) in such a manner the fiber assembly used for the thermosetting composite material, such as CFRP, retains its original organizational shape after decomposition, and a fiber assembly recovered by the method.Type: ApplicationFiled: November 25, 2016Publication date: June 15, 2017Applicant: Korea Institute of Science and TechnologyInventors: Munju GOH, Jin JUNG, Jin Won YU, Nam Ho YOU, Hyeonuk YEO, Sang Jun YOUN, Bon-Cheol KU
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Publication number: 20170096540Abstract: Provided are a composition for swelling pretreatment of a cured thermosetting resin material before decomposition, including a surfactant and an acidic material, and a method for swelling pretreatment of a cured thermosetting resin material before decomposition by using the same. When carrying out swelling pretreatment of a cured thermosetting resin material before decomposition by using the composition, it is possible to accelerate infiltration of the acidic material into the cured thermosetting resin material and swelling of the cured thermosetting resin material by virtue of the surfactant, and thus to increase the decomposition reactive surface area. Therefore, it is possible to increase reaction efficiency during the subsequent decomposition process, and to increase the decomposition ratio during the same period of time.Type: ApplicationFiled: October 3, 2016Publication date: April 6, 2017Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Munju GOH, Jin Won YU, Jin JUNG, Sang Jun YOUN, Bon-Cheol KU, Nam Ho YOU, Hyeonuk YEO
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Publication number: 20170022636Abstract: A cured epoxy resin material is depolymerized by using a composition including a compound represented by the chemical formula of XOmYn (wherein X is hydrogen, alkali metal or alkaline earth metal, Y is halogen, m is a number satisfying 1?m?8 and n is a number satisfying 1?n?6), and a reaction solvent, wherein X is capable of being dissociated from XOmYn and Y radical is capable of being produced from XOmYn in the reaction solvent. It is possible to carry out depolymerization of a cured epoxy resin material, for example, at 200° C., specifically 100° C. or lower, and to reduce a processing cost and an energy requirement. It is also possible to substitute for a reaction system using an organic solvent as main solvent, so that the contamination problems caused by the organic solvent functioning as separate contamination source may be solved and environmental contamination or pollution may be minimized.Type: ApplicationFiled: June 20, 2016Publication date: January 26, 2017Applicant: Korea Institute of Science and TechnologyInventors: Munju GOH, Bon-Cheol KU, Nam Ho YOU, Sang Jun YOUN, Hyeonuk YEO
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TRANSPARENT AND HEAT-INSULATING MATERIAL INCLUDING POLYMER CAPSULE AND METHOD FOR PREPARING THE SAME
Publication number: 20160069069Abstract: Provided are a transparent heat-insulating material including a transparent heat-insulating resin layer including polymer capsules and an optical resin, and a method for preparing the same. The transparent heat-insulating material may reduce the transmission of radiative heat of solar radiation energy entering from the exterior, and prevent discharge or loss of heat when indoor heating, while showing high transparency as well. In addition, the transparent heat-insulating material may allow easy control of the size of capsules contained in a transparent heat-insulating film, and may be obtained through a simple and easy process. Further, it is possible to control the light transmittability and heat-insulating property of the transparent heat-insulating material with ease.Type: ApplicationFiled: October 21, 2014Publication date: March 10, 2016Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Munju GOH, Nam Ho YOU, Hyeonuk YEO, Young Bum HONG -
Publication number: 20150261021Abstract: Disclosed are a liquid crystal film having a reflecting region that changes spontaneously depending on variations in external temperature and light intensity, and a method for manufacturing the same. More particularly, the liquid crystal film has a reflecting region that changes into a visible ray region when the external temperature and light intensity increase and into a near infrared ray region when the external temperature and quality of light decrease.Type: ApplicationFiled: May 27, 2014Publication date: September 17, 2015Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Munju GOH, Nam Ho YOU, Hyeonuk YEO, Seung Hee LEE, Young Bum HONG
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Patent number: 9040015Abstract: Provided are a method for post-treatment of a carbonaceous material using dehydrocyclization, a carbonaceous material post-treated by the method, and a polymer composite material including the carbonaceous material. More particularly, provided are a method for post-treatment of a carbonaceous material using dehydrocyclization, including subjecting the carbonaceous material to dehydrocyclization at room temperature to heal structural defects in the carbonaceous material, while increasing the effective conjugated length of the carbonaceous material to improve the electrical conductivity thereof, as well as a carbonaceous material post-treated by the method and a polymer composite material including the carbonaceous material.Type: GrantFiled: March 12, 2013Date of Patent: May 26, 2015Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Munju Goh, Ok-kyung Park, Yong Mun Choi, Bon-Cheol Ku, Joong Hee Lee, Nam Ho You, Han Sol You
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Patent number: 9017805Abstract: The present disclosure relates to a polyimide-graphene composite material and a method for preparing same. More particularly, it relates to a polyimide-graphene composite material prepared by adding modified graphene and a basic catalyst during polymerization of a polyimide precursor so as to improve mechanical strength and electrical conductivity and enable imidization at low temperature and a method for preparing same.Type: GrantFiled: March 26, 2013Date of Patent: April 28, 2015Assignee: Korea Institute of Science and TechnologyInventors: Nam Ho You, Ok-kyung Park, Bon-Cheol Ku, Joong Hee Lee, Munju Goh
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Publication number: 20150073088Abstract: Disclosed is a composite of filler and polymer resin and a method for preparing the same, including preparing a thermoplastic resin composition by mixing a polymerization catalyst with a polymerizable thermoplastic resin, preparing a pre-pellet including a filler and a polymer resin by mixing a filler with the thermoplastic resin composition and heating to perform in-situ polymerization of the polymerizable thermoplastic resin to the polymer resin, and compounding the pre-pellet or the pre-pellet to which a polymer resin is further added to be pelletized.Type: ApplicationFiled: October 30, 2013Publication date: March 12, 2015Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Seong Yun KIM, Cheol-Min YANG, Yong Chae JUNG, Junyeon HWANG, Yeji NOH, Hun-su LEE, Munju GOH
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Publication number: 20140191165Abstract: Provided are a method for post-treatment of a carbonaceous material using dehydrocyclization, a carbonaceous material post-treated by the method, and a polymer composite material including the carbonaceous material. More particularly, provided are a method for post-treatment of a carbonaceous material using dehydrocyclization, including subjecting the carbonaceous material to dehydrocyclization at room temperature to heal structural defects in the carbonaceous material, while increasing the effective conjugated length of the carbonaceous material to improve the electrical conductivity thereof, as well as a carbonaceous material post-treated by the method and a polymer composite material including the carbonaceous material.Type: ApplicationFiled: March 12, 2013Publication date: July 10, 2014Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Munju GOH, Ok-kyung PARK, Yong Mun CHOI, Bon-Cheol KU, Joong Hee LEE, Nam Ho YOU, Han Sol YOU