Abstract: A memory device includes a plurality of first cell blocks configured to store first data; a second cell block configured to store second data; a third cell block configured to store third data; a repair information storage circuit configured to output, based on repair information stored therein, a repair use signal corresponding to an input address; and an error correction circuit configured to: receive the second data as a first error correction code from the second cell block while selectively receiving, according to the repair use signal, the third data as a second error correction code from the third cell block, and correct errors in the first data from the first cell blocks using the first and second error correction codes.

Abstract: A memory system includes a memory controller including: a memory core configured to store data and an error correction code corresponding to the data; a syndrome generator configured to generate a first syndrome by substituting the data and the error correction code, read from the memory core, into a first check matrix, and generate a second syndrome by substituting the data and the error correction code, read from the memory core, into a second check matrix; and an error correction unit configured to correct an error of the read data and error correction code by using the first syndrome and the second syndrome, wherein constituents having values of ‘1’ in the first check matrix have values of ‘1’ also in the second check matrix.

Abstract: A memory system includes a memory controller including: a memory core configured to store data and an error correction code corresponding to the data; a syndrome generator configured to generate a first syndrome by substituting the data and the error correction code, read from the memory core, into a first check matrix, and generate a second syndrome by substituting the data and the error correction code, read from the memory core, into a second check matrix; and an error correction unit configured to correct an error of the read data and error correction code by using the first syndrome and the second syndrome, wherein constituents having values of ‘1’ in the first check matrix have values of ‘1’ also in the second check matrix.

Abstract: A semiconductor device may include a data storage region, a parity storage region and an error correction circuit. The data storage region may be configured to store first data and second data. The parity storage region may be configured to store a parity. The error correction circuit may be configured to correct an error of the first data or an error of the second data and the parity, based on a transmission selection signal.

Abstract: A semiconductor device may include an inversion control signal generation circuit, a pattern control signal generation circuit, and a data input/output (I/O) circuit. The inversion control signal generation circuit may generate an inversion control signal according to a logic level combination of bit patterns included in at least one of a first address and a second address. The pattern control signal generation circuit may generate a pattern control signal from a pre-control signal in response to the inversion control signal. In response to the pattern control signal, the data input/output (I/O) circuit may generate data signals that will be output to an internal I/O line based on data signals loaded on a local I/O line.

Abstract: A semiconductor device may include a syndrome generation circuit and a failure detection circuit. The syndrome generation circuit may generate a syndrome signal corresponding to a pattern of an output data signal. The failure detection circuit may detect the syndrome signal and sequentially store the syndrome signal to generate a first syndrome signal and a second syndrome signal if an error is detected from the syndrome signal. The failure detection circuit may generate a failure detection signal which is enabled if a logic level combination of the first syndrome signal is different from a logic level combination of the second syndrome signal.

Abstract: A semiconductor device may include a syndrome generation circuit and a failure detection circuit. The syndrome generation circuit may generate a syndrome signal corresponding to a pattern of an output data signal. The failure detection circuit may detect the syndrome signal and sequentially store the syndrome signal to generate a first syndrome signal and a second syndrome signal if an error is detected from the syndrome signal. The failure detection circuit may generate a failure detection signal which is enabled if a logic level combination of the first syndrome signal is different from a logic level combination of the second syndrome signal.

Abstract: A semiconductor device may include a data storage region, a parity storage region and an error correction circuit. The data storage region may be configured to store first data and second data. The parity storage region may be configured to store a parity. The error correction circuit may be configured to correct an error of the first data or an error of the second data and the parity, based on a transmission selection signal.

Abstract: A semiconductor device may include an inversion control signal generation circuit, a pattern control signal generation circuit, and a data input/output (I/O) circuit. The inversion control signal generation circuit may generate an inversion control signal according to a logic level combination of bit patterns included in at least one of a first address and a second address. The pattern control signal generation circuit may generate a pattern control signal from a pre-control signal in response to the inversion control signal. In response to the pattern control signal, the data input/output (I/O) circuit may generate data signals that will be output to an internal I/O line based on data signals loaded on a local I/O line.

Abstract: Semiconductor device including an input and output line control circuit may be provided. The input/output line control circuit may include a write connection circuit configured to transmit data of a write local line pair based on a write control signal. The input/output line control circuit may include a connection circuit configured to transmit data received from the write connection circuit to a write segment line pair based on a switching signal. The input/output line control circuit may be configured to transmit data of the write local line pair to the write segment line pair, based on the switching signal and the write control signal.

Abstract: A power-up circuit of a semiconductor apparatus includes a detection block configured to detect a first target level of an external voltage and activate a power-up signal; and a bias block configured to divide the external voltage according to a division ratio that is variable in response to the power-up signal, and output a bias voltage.

Abstract: A power driving circuit including a voltage generation unit configured to generate a release control signal and an output voltage. The power driving circuit including a release controller configured to enable a release signal during an activation section of a flag signal in response to the release control signal. The power driving circuit including a pull-up driving unit configured to increase a level of the output voltage in response to the release control signal. The power driving circuit including a release driving unit configured to synchronize a level of the output voltage in response to the release signal.

Abstract: An amplification circuit of a semiconductor apparatus includes a first amplification unit configured to amplify a difference between an input voltage and a reference voltage and generate a preliminary amplification signal, a second amplification unit configured to secondarily amplify the preliminary amplification signal and generate an amplification signal, and a compensation unit configured to form an addition current path.

Abstract: A power-up circuit of a semiconductor apparatus includes a detection block configured to detect a first target level of an external voltage and activate a power-up signal; and a bias block configured to divide the external voltage according to a division ratio that is variable in response to the power-up signal, and output a bias voltage.

Abstract: An amplification circuit of a semiconductor apparatus includes a first amplification unit configured to amplify a difference between an input voltage and a reference voltage and generate a preliminary amplification signal, a second amplification unit configured to secondarily amplify the preliminary amplification signal and generate an amplification signal, and a compensation unit configured to form an addition current path.