Patents by Inventor Murakami Yoshinobu

Murakami Yoshinobu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4442061
    Abstract: A heat cycle injection compression molding method comprises several steps: heating a synthetic resin until it becomes fluidized; injecting the fluidized synthetic resin into a large and nonuniform cavity formed by a cavity block and a mold which is slightly opened; cooling the injected fluidized resin until the center portion temperature of the resin is equal to or lower than a solidifying temperature of the resin, thereby solidifying the resin; reheating the solidified resin uniformly until the temperature of the resin is higher than the solidifying temperature, thereby making the resin fluidized again; compressing the refluidized resin by reducing the volume of the cavities; cooling the refluidized resin until the temperature of the refluidized resin is lower than a take-out set temperature, while continuing the compressing step, thereby resolidifying the resin; stopping the compressing step; and ejecting out of the mold a formed product having a large and nonuniform thickness.
    Type: Grant
    Filed: July 15, 1982
    Date of Patent: April 10, 1984
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shunsuke Matsuda, Akio Ito, Mitani Katsuaki, Murakami Yoshinobu, Tamura Tooru