Abstract: The present disclosure is directed to thermal management and electromagnetic interference (EMI) shielding techniques for a system on a chip (SOC) device to reduce the thermal resistance between a SOC die of the SOC device and heat dissipation components, while still providing EMI shielding to components of the SOC device. For example, a SOC device may include an EMI mesh disposed on the SOC die. The EMI mesh includes a plurality of windows such that a thermal interface material (TIM) may extend through the plurality of windows and physically couple both the heat dissipation components (e.g., a spreader) and the SOC die while still providing EMI shielding to the SOC die.