Abstract: A method of manufacturing a semiconductor package which is at least in part covered by an electromagnetic interference shielding layer. The method includes at least these steps: i. providing the semiconductor package and an ink composition having at least a compound comprising at least one metal precursor and at least one organic compound; ii. applying at least a part of the ink composition onto the semiconductor package, wherein a precursor layer is formed; and iii. treating the precursor layer with an irradiation of a peak wavelength in the range from 100 nm to 1 mm. Further disclosed is a semiconductor package comprising an electromagnetic interference shielding layer comprising at least one metal, wherein the semiconductor package is obtainable by the aforementioned method. Still further disclosed are a semiconductor package comprising an electromagnetic interference shielding layer having a specific conductance and thickness, and uses of an ink composition.

Abstract: A combination of agents capable of binding an infectious agent, such as an antibody, an antibody derivative, or an antibody mimetic, and immunomodulatory agents, such as probiotic strains, for the treatment or prevention of respiratory infections, in particular bacterial respiratory infections. The agents capable of binding an infectious agent are administered by inhalation.

Abstract: The present invention relates to a bacterial strain of the Faecalibacterium prausnitzii species selected from a bacterial strain belonging to one of the phylogroups I, II and III, for use in the treatment and/or prevention of visceral abdominal pain in an individual. The present invention also concerns compositions comprising said bacterial strains as well as specific strains as such.

Abstract: The present invention relates to the use of a bacterium of the genus Lactobacillus in the treatment of respiratory diseases in humans as well as in animals. in particular, a particular strain of this bacterium and pharmaceutical compositions comprising it are described.

Abstract: The invention relates to a novel bacterial strain deposited with the CNCM under number 1-4969. This strain has properties that are useful in the treatment of respiratory disorders. The invention also relates to compositions and uses of said strain.

Abstract: The invention relates to a lyophilized composition comprising a microbiota in its ecosystem, in particular stools, and a mixture of cryoprotectant agents comprising maltodextrin and trehalose, a capsule comprising said lyophilized composition, the use thereof, and methods for the production thereof.

Abstract: The present invention relates to a bacterial strain of the Faecalibacterium prausnitzii species selected from a bacterial strain belonging to one of the phylogroups I, II and III, for use in the treatment and/or prevention of visceral abdominal pain in an individual. The present invention also concerns compositions comprising said bacterial strains as well as specific strains as such.

Abstract: The present invention relates to a bacterial strain of the Faecalibacterium prausnitzii species selected from a bacterial strain belonging to one of the phylogroups I, II and III, for use in the treatment and/or prevention of visceral abdominal pain in an individual. The present invention also concerns compositions comprising said bacterial strains as well as specific strains as such.

Abstract: The invention relates to a lyophilized composition comprising a microbiota in its ecosystem, in particular stools, and a mixture of cryoprotectant agents comprising maltodextrin and trehalose, a capsule comprising said lyophilized composition, the use thereof, and methods for the production thereof.

Abstract: The invention relates to a novel bacterial strain deposited with the CNCM under number 1-4969. This strain has properties that are useful in the treatment of respiratory disorders. The invention also relates to compositions and uses of said strain.

Abstract: A no-clean low residue solder paste is described for die-attach dispensing or fine pitch printing of semiconductor devices. The solder paste has a homogeneous consistency with no tendency to paste separation. The ultimately remaining residue is clear and crystal like and is compatible with further processing steps without prior cleaning with a solvent to remove flux residue. The solder paste comprises a relatively low amount of rosin in combination with a viscous solvent system, thixotropic agents, activators, additives and optionally plasticizers.

Abstract: A no-clean low residue solder paste is described for die-attach dispensing or fine pitch printing of semiconductor devices. The solder paste has a homogeneous consistency with no tendency to paste separation. The ultimately remaining residue is clear and crystal like and is compatible with further processing steps without prior cleaning with a solvent to remove flux residue. The solder paste comprises a relatively low amount of rosin in combination with a viscous solvent system, thixotropic agents, activators, additives and optionally plasticizers.

Abstract: The Directive 2002/95/EC of the European Parliament and of the Council promulgated that from 1 Jul. 2006 new electrical and electronic equipment must no longer contain lead. Accordingly, lead-free solder alloys for various electrical and electronic applications have been developed. But at present, lead in high melting temperature type solders, e.g. used for die-attach applications, are exempted from the directive due to lack of lead-free alternatives for these alloys. The present invention provides a lead-free die-attach composition for attaching high power semiconductor devices to printed circuit boards. The die-attach composition comprises a metal filled epoxy resin, wherein the metal is selected from a powder comprising copper and having spheroidal particles with less than half of the copper atoms in a surface layer being oxidized as measured by XPS.