Patents by Inventor Murlidhar V. Kulkarni

Murlidhar V. Kulkarni has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5544775
    Abstract: A method is provided for making a high definition, high aspect ratio amorphous carbon element, such as a slider, which carries one or more magnetic heads in a disk drive. A special gaseous environment is provided during laser etching which results in virtually no redeposition of the etched material. The result is a carbon element which has good edge definition for establishing desirable flying characteristics of a slider. In a preferred embodiment the laser etching, which is preferably implemented by an excimer laser, is performed in an gaseous environment of oxygen saturated with water vapor at a pressure above ambient. Significant improvements were also realized with nitrogen saturated with water vapor at a pressure above ambient and steam at ambient pressure. High aspect ratios were achieved, namely slope angles of 50.degree. to 60.degree..
    Type: Grant
    Filed: December 22, 1994
    Date of Patent: August 13, 1996
    Assignee: International Business Machines Corporation
    Inventors: Randall T. Kerth, Douglas J. Krajnovich, Murlidhar V. Kulkarni, Wing P. Leung, Andrew C. Tam
  • Patent number: 4844616
    Abstract: The invention is a method for detecting both surface topography and defect presence using an AC interferometer. Surface topography measurements are maximized by adjusting the signal voltage of the light modulator to a relative phase-sensitive value. Defect detection is maximized by adjusting the signal voltage of the light modulator to a relatively phase-insensitive value. This method not only allows for heretofore unknown defect detection by an AC interferometer but, because the signal voltage can be switched electronically, permits both observations to be taken at a high speed and for many points of a specimen, thereby making the method suitable for the manufacturing environment. More specifically, the method would be applicable to both optical disk and microchip manufacturing.
    Type: Grant
    Filed: May 31, 1988
    Date of Patent: July 4, 1989
    Assignee: International Business Machines Corporation
    Inventors: Murlidhar V. Kulkarni, William H. Lancaster, Jr.
  • Patent number: 4590574
    Abstract: An infrared Fourier transform spectrometer is used to measure the absorbance spectrum of a sample of unknown oxygen or carbon content. From the spectrum, the roughness of the wafer is defined, and such roughness definition is then used to calculate the oxygen or carbon content. The roughness can be defined by using the slope of the absorbance spectrum or by the degree of shift of the baseline of the oxygen or carbon peak.
    Type: Grant
    Filed: April 29, 1983
    Date of Patent: May 20, 1986
    Assignee: International Business Machines Corp.
    Inventors: Harold D. Edmonds, Murlidhar V. Kulkarni
  • Patent number: 4506158
    Abstract: A new spectrometer station for semiconductor wafers is provided that permits operation in both the reflective and absorption modes either simultaneously or sequentially while the wafer is in a horizontal position. The wafer is positioned in the station on a movable platform. Positioned under the platform is an infrared detector. An optical system over the platform focuses an interferometer beam at that portion of the wafer positioned right over the detector. It also directs light from the beam reflected off the top surface of the wafer at a second infrared detector. An orientor rotates the wafer on the platform so that movement of the wafer by the orientor and movement of the platform allows any part of the wafer to be examined as a test point by the spectrometer.
    Type: Grant
    Filed: March 3, 1983
    Date of Patent: March 19, 1985
    Assignee: International Business Machines Corporation
    Inventors: Robert H. Cadwallader, Harold D. Edmonds, Murlidhar V. Kulkarni
  • Patent number: 4432809
    Abstract: The rate of oxygen precipitation in a semiconductor wafer during heat treatment is reduced by quickly inserting the wafer into a furnace which has been preheated to the heat treatment temperature. After performing the heat treatment, the wafer is slowly cooled to prevent warpage or cracking.
    Type: Grant
    Filed: March 10, 1982
    Date of Patent: February 21, 1984
    Assignee: International Business Machines Corporation
    Inventors: Patrick W. Chye, Eric W. Hearn, Murlidhar V. Kulkarni, Gary Markovits