Patents by Inventor Murray Fitzpatrick Kelley

Murray Fitzpatrick Kelley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11043459
    Abstract: Techniques are described for fabricating integrated circuit devices that span multiple reticle fields. Integrated circuits formed within separate reticle fields are placed into electrical contact with each other by overlapping reticle fields to form an overlapping conductive interconnect. This overlapping conductive interconnect electrically connects an interconnect layer of a first reticle field with an interconnect layer of a second, laterally adjacent reticle field. The overlapping conductive interconnection extends into a common scribe zone between adjacent reticle fields.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: June 22, 2021
    Assignee: Intel Corporation
    Inventors: Edward A. Burton, Mark T. Bohr, Murray Fitzpatrick Kelley, Shawn Michael Klauser
  • Publication number: 20200066651
    Abstract: Techniques are described for fabricating integrated circuit devices that span multiple reticle fields. Integrated circuits formed within separate reticle fields are placed into electrical contact with each other by overlapping reticle fields to form an overlapping conductive interconnect. This overlapping conductive interconnect electrically connects an interconnect layer of a first reticle field with an interconnect layer of a second, laterally adjacent reticle field. The overlapping conductive interconnection extends into a common scribe zone between adjacent reticle fields.
    Type: Application
    Filed: June 29, 2017
    Publication date: February 27, 2020
    Applicant: INTEL CORPORATION
    Inventors: Edward A. Burton, Mark T. Bohr, Murray Fitzpatrick Kelley, Shawn Michael Klauser