Patents by Inventor Murray W. Hamilton

Murray W. Hamilton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adjustable seating system
    Patent number: 6990920
    Abstract: A seating system for use in a watercraft is disclosed. The seating system comprises a seat pan adapted to be mounted to the watercraft, a pad coupled to the seat pan and adapted to provide a seating surface for the user, and a back rest coupled to the seat pan. The seating system further comprises a first adjustment mechanism configured to provide for and aft adjustment of the seating position, a second adjustment mechanism configured to provide adjustment of the back rest without having to exit the watercraft, and a third adjustment mechanism configured to provide adjustment of the seating surface.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: January 31, 2006
    Assignee: Johnson Outdoors Inc.
    Inventors: Murray W. Hamilton, Andrew S. Galdwin, Gary Seaman, Raymond H. Klein, II, David E. Vanderveen
  • Adjustable seating system
    Publication number: 20020175549
    Abstract: A seating system for use in a watercraft is disclosed. The seating system comprises a seat pan adapted to be mounted to the watercraft, a pad coupled to the seat pan and adapted to provide a seating surface for the user, and a back rest coupled to the seat pan. The seating system further comprises a first adjustment mechanism configured to provide for and aft adjustment of the seating position, a second adjustment mechanism configured to provide adjustment of the back rest without having to exit the watercraft, and a third adjustment mechanism configured to provide adjustment of the seating surface.
    Type: Application
    Filed: May 13, 2002
    Publication date: November 28, 2002
    Applicant: Johnson Outdoors Inc.
    Inventors: Murray W. Hamilton, Andrew S. Galdwin, Gary Seaman, Raymond H. Klein, David E. Vanderveen
  • Method of assembling substrates and electronic components
    Patent number: 6313412
    Abstract: A method of assembling a substrate and an electrical or electronic component, the component having electrically conductive leads with surfaces of an alloy from the list consisting of tin, nickel, tin copper, tin silver, nickel palladium, gold palladium, and silver palladium, and the leads being soldered to copper-based terminals of the substrate by a solder alloy, the solder alloy comprising, by weight, 99.3% tin and 0.7% copper. The soldering takes place in a chamber having a nitrogen inert atmosphere. Lead solder is thus avoided.
    Type: Grant
    Filed: August 6, 1998
    Date of Patent: November 6, 2001
    Assignee: Nortel Networks Limited
    Inventors: William P. Trumble, Murray W. Hamilton, David Bilton