Patents by Inventor Musan Hu

Musan Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board with non-plated hole interposed between plated holes to prevent formation of conductive anodic filament
    Patent number: 10631407
    Abstract: In one embodiment, an apparatus includes a plurality of layers in a circuit board, each of the layers comprising a fiber weave, two plated holes extending through the layers and connecting two or more of the layers, and a non-plated hole interposed between the plated holes. The non-plated hole passes through a potential CAF (Conductive Anodic Filament) migration path along the fiber weave to prevent CAF formation between the plated holes.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: April 21, 2020
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Jennifer Oliver, Ashok Kumar Singh, Musan Hu, David Senk