Abstract: Improved device aging monitoring and compensation schemes are presented herein. In particular, embodiments enable quantitative measurement of actual aging experienced by a device up to the instant of measurement, rather than rely on static a priori estimation of aging effects under worst case conditions. As such, embodiments provide adaptive device aging monitoring and compensation schemes. In addition, embodiments allow for aging monitoring and compensation to be performed at a desired granularity, whereby aging monitoring and compensation can be performed at a chip, module, or sub-module level. Further, embodiments inherently compensate for the effects of aging on passive components (e.g., parasitics of interconnect wires, capacitors, etc.) in addition to active device aging.