Patents by Inventor Mustafa H. Haswarey

Mustafa H. Haswarey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • All-inclusive CPU carrier that enable automation and tool free operation at low-cost while improving thermal performance
    Patent number: 11271335
    Abstract: Embodiments include a carrier assembly, a method of forming the carrier assembly, and a semiconductor package. A carrier assembly includes a socket on a package substrate, and a carrier having a transparent material, a first opening, first alignment openings, and barbs. The carrier assembly also includes an electronic device embedded into the first opening of carrier and coupled to the carrier by barbs. The carrier assembly further includes a bolster plate on the package substrate, the bolster plate having a second opening, loading studs, and second alignment openings, and the second opening surrounds the socket. Each loading stud is positioned on a corner edge of the bolster plate. The carrier assembly may align the first alignment openings above the second alignment openings to couple the carrier onto the bolster plate. The carrier assembly may include a heat sink disposed on the electronic device, carrier, and bolster plate.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: March 8, 2022
    Assignee: Intel Corporation
    Inventors: Mustafa H. Haswarey, Ming-Chen Chang, Divya Swamy Bandaru
  • Socket cover
    Patent number: 11217934
    Abstract: Embodiments may relate to a cover for a socket of a computing device. The cover may include a cover piece and a locking mechanism attached to the cover piece by a hinge. The locking mechanism, when in a locked position, may removably secure the cover to a bolster such that the cover piece overlays the socket. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Ming-Chen Chang, Mustafa H. Haswarey, Praneetha Kolla, Whitten Schulz
  • ALL-INCLUSIVE CPU CARRIER THAT ENABLE AUTOMATION AND TOOL FREE OPERATION AT LOW-COST WHILE IMPROVING THERMAL PERFORMANCE
    Publication number: 20190393631
    Abstract: Embodiments include a carrier assembly, a method of forming the carrier assembly, and a semiconductor package. A carrier assembly includes a socket on a package substrate, and a carrier having a transparent material, a first opening, first alignment openings, and barbs. The carrier assembly also includes an electronic device embedded into the first opening of carrier and coupled to the carrier by barbs. The carrier assembly further includes a bolster plate on the package substrate, the bolster plate having a second opening, loading studs, and second alignment openings, and the second opening surrounds the socket. Each loading stud is positioned on a corner edge of the bolster plate. The carrier assembly may align the first alignment openings above the second alignment openings to couple the carrier onto the bolster plate. The carrier assembly may include a heat sink disposed on the electronic device, carrier, and bolster plate.
    Type: Application
    Filed: June 25, 2018
    Publication date: December 26, 2019
    Inventors: Mustafa H. HASWAREY, Ming-Chen CHANG, Divya Swamy BANDARU
  • SOCKET COVER
    Publication number: 20190393643
    Abstract: Embodiments may relate to a cover for a socket of a computing device. The cover may include a cover piece and a locking mechanism attached to the cover piece by a hinge. The locking mechanism, when in a locked position, may removably secure the cover to a bolster such that the cover piece overlays the socket. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: June 22, 2018
    Publication date: December 26, 2019
    Applicant: Intel Corporation
    Inventors: Ming-Chen Chang, Mustafa H. Haswarey, Praneetha Kolla, Whitten Schulz
  • Quick release retention mechanism for socketed microelectronic devices
    Patent number: 8382503
    Abstract: The present description relates to the field of microelectronic device retention mechanisms and, more particularly, to a quick release retention mechanism including a base plate, a load plate and a biasing mechanism adapted to apply a desired load and to allow rapid insertion and extraction of microelectronic devices from sockets.
    Type: Grant
    Filed: December 17, 2010
    Date of Patent: February 26, 2013
    Assignee: Intel Corporation
    Inventors: Aslam H. Haswarey, Mustafa H. Haswarey, Ridvan A. Sahan, Rahima K. Mohammed
  • QUICK RELEASE RETENTION MECHANISM FOR SOCKETED MICROELECTRONIC DEVICES
    Publication number: 20120156913
    Abstract: The present description relates to the field of microelectronic device retention mechanisms and, more particularly, to a quick release retention mechanism including a base plate, a load plate and a biasing mechanism adapted to apply a desired load and to allow rapid insertion and extraction of microelectronic devices from sockets.
    Type: Application
    Filed: December 17, 2010
    Publication date: June 21, 2012
    Inventors: Aslam H. Haswarey, Mustafa H. Haswarey, Ridvan A. Sahan, Rahima K. Mohammed