Patents by Inventor Mutian Hua

Mutian Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hierarchically Structured Hydrogel with Tunable Mechanical Properties
    Publication number: 20230331937
    Abstract: Many embodiments provide methods to produce hydrogels with water content of at least 70% with multi-length-scale hierarchical architecture. The hydrogels have high mechanical stress, high strain, and high toughness. The method includes a pre-concentrating step and a salting-out treatment. The produced hydrogels are anisotropic, comprising micro-sized honeycomb-like pore walls, which in turn comprise interconnected nanofibrils meshes.
    Type: Application
    Filed: February 7, 2023
    Publication date: October 19, 2023
    Applicant: The Regents of the University of California
    Inventors: Ximin He, Mutian Hua, Shuwang Wu
  • Methods for photo-induced metal printing
    Patent number: 11639025
    Abstract: Methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D Metal structures are provided. The methods and apparatus operate via photo-(stereo)lithography at room temperature. The printed metal patterns, for example silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of the silver printed by current laser sintering or thermal annealing at high temperature.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: May 2, 2023
    Assignee: The Regents of the University of California
    Inventors: Ximin He, Xingyun Yang, Dong Wu, Mutian Hua
  • Methods for Photo-Induced Metal Printing
    Publication number: 20210146610
    Abstract: Methods and apparatus for fabricating high-resolution thin-layer metal patterns and 3D Metal structures are provided. The methods and apparatus operate via photo-(stereo)lithography at room temperature. The printed metal patterns, for example silver patterns, exhibit high electrical conductivity, comparable to or better than the conductivity of the silver printed by current laser sintering or thermal annealing at high temperature.
    Type: Application
    Filed: April 3, 2019
    Publication date: May 20, 2021
    Applicant: The Regents of the University of California
    Inventors: Ximin He, Xingyun Yang, Dong Wu, Mutian Hua