Patents by Inventor Mutsumi Agawa

Mutsumi Agawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5473190
    Abstract: A TAB tape is constituted by a base material consisting of, e.g., a polyimide, in which leads composed of a copper foil are formed on the base material, and a power supply unit and a signal unit formed on a substrate, such as a printed circuit board, are connected to electrodes formed on a chip via the copper foil leads. Power supply leads for supplying power to the chip, ground leads for grounding, and signal leads for exchanging signals with the chip are formed by the copper foil on one surface of the base material. A common power supply lead to be connected to the power supply leads and a common ground lead to be connected to the ground leads are formed by the copper foil on the other surface of the base material.
    Type: Grant
    Filed: December 14, 1993
    Date of Patent: December 5, 1995
    Assignee: Intel Corporation
    Inventors: Shuji Inoue, Yasuhiko Hiraki, Mutsumi Agawa