Patents by Inventor Mutsumi Kano

Mutsumi Kano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter
    Patent number: 6888344
    Abstract: A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of: ?=cos?1(1?t/R)?15° where the radius of curvature of the spherical surface is R, the thickness of the pad is t, and the angle formed at the pad surface between the tangential line with respect to the probe tip face and the pad surface when the probe is pressed against the pad is ?, the probe have a flat portion at an end of the tip portion.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: May 3, 2005
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Shigeki Maekawa, Megumi Takemoto, Kazunobu Miki, Mutsumi Kano, Takahiro Nagata, Yoshihiro Kashiba
  • Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter
    Patent number: 6646455
    Abstract: A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of: &thgr;=cos−1(1−t/R)≧15° where the radius of curvature of the spherical surface is R, the thickness of the pad is t, and the angle formed at the pad surface between the tangential line with respect to the probe tip face and the pad surface when the probe is pressed against the pad is &thgr;, the probe have a flat portion at an end of the tip portion.
    Type: Grant
    Filed: July 24, 1998
    Date of Patent: November 11, 2003
    Assignee: Mitsubishi Denki Kabsuhiki Kaisha
    Inventors: Shigeki Maekawa, Megumi Takemoto, Kazunobu Miki, Mutsumi Kano, Takahiro Nagata, Yoshihiro Kashiba
  • Test probe for semiconductor devices, method of manufacturing of the same, and member for removing foreign matter
    Publication number: 20030090280
    Abstract: A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of:
    Type: Application
    Filed: November 1, 2002
    Publication date: May 15, 2003
    Inventors: Shigeki Maekawa, Megumi Takemoto, Kazunobu Miki, Mutsumi Kano, Takahiro Nagata, Yoshihiro Kashiba
  • TEST PROBE FOR SEMICONDUCTOR DEVICES, METHOD OF MANUFACTURING OF THE SAME, AND MEMBER FOR REMOVING FOREIGN MATTER
    Publication number: 20020097060
    Abstract: A test probe for semiconductor devices, the test probe having a tip portion which is pressed against a test pad of a semiconductor device to establish electrical contact between the tip portion and the pad for testing the operation of the semiconductor device, wherein the probe is formed to have a tip shape with an angle of not less than 15 degrees formed at the surface of the pad between a tangential line with respect to a tip face of the probe and the pad surface when the probe is pressed against the pad, the tip shape of the probe having a spherical surface meeting the relationship of:
    Type: Application
    Filed: July 24, 1998
    Publication date: July 25, 2002
    Inventors: SHIGEKI MAEKAWA, MEGUMI TAKEMOTO, KAZUNOBU MIKI, MUTSUMI KANO, TAKAHIRO NAGATA, YOSHIHIRO KASHIBA