Patents by Inventor Mutsumi Tanikawa
Mutsumi Tanikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9533395Abstract: A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.Type: GrantFiled: February 11, 2016Date of Patent: January 3, 2017Assignee: EBARA CORPORATIONInventors: Mutsumi Tanikawa, Takahiro Shimano
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Patent number: 9469013Abstract: A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.Type: GrantFiled: June 5, 2012Date of Patent: October 18, 2016Assignee: Ebara CorporationInventors: Mutsumi Tanikawa, Takahiro Shimano
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Publication number: 20160158911Abstract: A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.Type: ApplicationFiled: February 11, 2016Publication date: June 9, 2016Inventors: Mutsumi TANIKAWA, Takahiro SHIMANO
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Patent number: 9156130Abstract: The method includes the steps of measuring a surface height of a polishing member 10 at each of plural oscillation sections Z1 to Z5 which are defined in advance on the polishing member 10 along an oscillation direction of a dresser 5; calculating a difference between a current profile obtained from measured values of the surface height and a target profile of the polishing member 10; and correcting moving speeds of the dresser 5 in the plural oscillation sections Z1 to Z5 so as to eliminate the difference.Type: GrantFiled: February 21, 2014Date of Patent: October 13, 2015Assignee: Ebara CorporationInventors: Takahiro Shimano, Mutsumi Tanikawa, Hisanori Matsuo, Kuniaki Yamaguchi, Katsuhide Watanabe
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Patent number: 9108292Abstract: The method includes: calculating an increment of a sliding distance of a dresser by multiplying a relative speed between the dresser and a polishing member by a contact time between them; correcting the increment of the sliding distance by multiplying the calculated increment of the sliding distance by at least one correction coefficient; calculating the sliding distance by repeatedly adding the corrected increment of the sliding distance to the sliding distance according to elapse of time; and producing the sliding-distance distribution of the dresser from the obtained sliding distance and a position of a sliding-distance calculation point. The at least one correction coefficient includes an unevenness correction coefficient provided for the sliding-distance calculation point.Type: GrantFiled: February 19, 2014Date of Patent: August 18, 2015Assignee: Ebara CorporationInventors: Takahiro Shimano, Mutsumi Tanikawa, Hisanori Matsuo, Kuniaki Yamaguchi, Katsuhide Watanabe
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Publication number: 20140342642Abstract: The method includes: calculating an increment of a sliding distance of a dresser by multiplying a relative speed between the dresser and a polishing member by a contact time between them; correcting the increment of the sliding distance by multiplying the calculated increment of the sliding distance by at least one correction coefficient; calculating the sliding distance by repeatedly adding the corrected increment of the sliding distance to the sliding distance according to elapse of time; and producing the sliding-distance distribution of the dresser from the obtained sliding distance and a position of a sliding-distance calculation point. The at least one correction coefficient includes an unevenness correction coefficient provided for the sliding-distance calculation point.Type: ApplicationFiled: February 19, 2014Publication date: November 20, 2014Inventors: Takahiro SHIMANO, Mutsumi TANIKAWA, Hisanori MATSUO, Kuniaki YAMAGUCHI, Katsuhide WATANABE
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Publication number: 20140287653Abstract: The method includes the steps of measuring a surface height of a polishing member 10 at each of plural oscillation sections Z1 to Z5 which are defined in advance on the polishing member 10 along an oscillation direction of a dresser 5; calculating a difference between a current profile obtained from measured values of the surface height and a target profile of the polishing member 10; and correcting moving speeds of the dresser 5 in the plural oscillation sections Z1 to Z5 so as to eliminate the difference.Type: ApplicationFiled: February 21, 2014Publication date: September 25, 2014Inventors: Takahiro SHIMANO, Mutsumi TANIKAWA, Hisanori MATSUO, Kuniaki YAMAGUCHI, Katsuhide WATANABE
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Publication number: 20120315829Abstract: A method of conditioning a surface of a polishing pad is used for conditioning a polishing pad on a polishing table for polishing a thin film formed on a surface of a substrate. The conditioning method includes bringing a dresser into contact with the polishing pad, and conditioning the polishing pad by moving the dresser between a central part of the polishing pad and an outer circumferential part of the polishing pad. A moving speed of the dresser at a predetermined area of the polishing pad is higher than a standard moving speed of the dresser at the predetermined area of the polishing pad.Type: ApplicationFiled: June 5, 2012Publication date: December 13, 2012Inventors: Mutsumi TANIKAWA, Takahiro SHIMANO
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Patent number: 6508695Abstract: A pure water reusing system recovers water discharged from apparatuses in which pure water is used, and regenerates the water to produce pure water. The pure water reusing system has a recovering and regenerating apparatus for recovering water discharged from the apparatuses and regenerating the water by removing impurities from the water to produce pure water, and a regenerated pure water supply line for supplying the regenerated pure water to at least one of the apparatuses. The same process is conducted in the apparatuses in which pure water is used.Type: GrantFiled: March 27, 2001Date of Patent: January 21, 2003Assignees: Ebara Corporation, Kabushiki Kaisha ToshibaInventors: Mutsumi Tanikawa, Mitsunori Komatsu, Kiyotaka Kawashima, Hiroshi Shimomoto, Katsuya Okumura
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Patent number: 6358125Abstract: A polishing liquid supply apparatus supplies a polishing liquid to a polishing unit. The polishing liquid supply apparatus includes a supply tank for storing a polishing liquid having a predetermined concentration, and a polishing liquid pipe for delivering the polishing liquid from the supply tank to a polishing liquid supply nozzle in the polishing unit. The polishing liquid supply apparatus further includes an additive tank for storing an additive having a predetermined concentration, and an additive supply pipe for adding the additive supplied from the additive tank to the polishing liquid stored in the supply tank or to the polishing liquid in a polishing liquid passage including the polishing liquid pipe.Type: GrantFiled: November 29, 2000Date of Patent: March 19, 2002Assignee: Ebara CorporationInventors: Kiyotaka Kawashima, Mutsumi Tanikawa, Hiroshi Shimomoto, Keiko Chono
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Patent number: 6338671Abstract: An apparatus for supplying a polishing liquid to a polishing section is used for polishing a surface of a semiconductor substrate in the polishing section. The apparatus comprises a supply tank for storing a polishing liquid having given properties, a supply pipe for supplying the polishing liquid to the polishing section, a sensing device for detecting properties of the polishing liquid flowing through the supply pipe, and a stabilization device for maintaining properties of the polishing liquid stored in the supply tank or flowing through the supply pipe within an allowable range on the basis of an output signal from the sensing device.Type: GrantFiled: March 24, 2000Date of Patent: January 15, 2002Assignee: Ebara CorporationInventors: Kiyotaka Kawashima, Mitsunori Komatsu, Mutsumi Tanikawa, Fujihiko Toyomasu
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Publication number: 20010034190Abstract: A pure water reusing system recovers water discharged from apparatuses in which pure water is used, and regenerates the water to produce pure water. The pure water reusing system comprises a recovering and regenerating apparatus for recovering water discharged from the apparatuses and regenerating the water by removing impurities from the water to produce pure water, and a regenerated pure water supply line for supplying the regenerated pure water to at least one of the apparatuses. The same process is conducted in the apparatuses in which pure water is used.Type: ApplicationFiled: March 27, 2001Publication date: October 25, 2001Inventors: Mutsumi Tanikawa, Mitsunori Komatsu, Kiyotaka Kawashima, Hiroshi Shimomoto, Katsuya Okumura
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Patent number: 6280300Abstract: A filter apparatus provided in a fluid pipeline for conveying a treatment fluid. A regenerating pipeline is provided adjacently to the fluid pipeline to convey a regenerating liquid. At least two filter units are switched between the fluid pipeline and the regenerating pipeline by a switching valve device. The filter apparatus enables a filter replacing operation to be carried out smoothly and reliably and is also capable of reliably trapping solid particles contained in the fluid, e.g. an abrasive liquid, continuously without the need of a filter replacing operation, thereby allowing supply of a fluid of high quality and a stable operation free from clogging.Type: GrantFiled: November 26, 1999Date of Patent: August 28, 2001Assignee: Ebara CorporationInventors: Mitsunori Komatsu, Kiyotaka Kawashima, Mutsumi Tanikawa
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Publication number: 20010002361Abstract: A polishing liquid supply apparatus supplies a polishing liquid to a polishing unit. The polishing liquid supply apparatus includes a supply tank for storing a polishing liquid having a predetermined concentration, and a polishing liquid pipe for delivering the polishing liquid from the supply tank to a polishing liquid supply nozzle in the polishing unit. The polishing liquid supply apparatus further includes an additive tank for storing an additive having a predetermined concentration, and an additive supply pipe for adding the additive supplied from the additive tank to the polishing liquid stored in the supply tank or to the polishing liquid in a polishing liquid passage including the polishing liquid pipe.Type: ApplicationFiled: November 29, 2000Publication date: May 31, 2001Inventors: Kiyotaka Kawashima, Mutsumi Tanikawa, Hiroshi Shimomoto, Keiko Chono