Abstract: An electronic device mounting structure includes an electronic device, a busbar, and a solder. The electronic device has a body and a lead protruding from the body. The busbar has a flat portion and a wall portion rising from a periphery of the flat portion. The flat portion of the busbar extends parallel to a tip portion of the lead and is in contact with a back surface of the tip portion. The wall portion of the busbar faces a side surface of the tip portion with a predetermined space. The solder is located in the space and joins the side surface of the tip portion and the wall portion of the busbar.

Abstract: An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.

Abstract: An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.

Abstract: In an electronic apparatus, a busbar assembly is composed of busbars made of at least one previously selected metal material. Each of the busbars has one surface. A solder joint is made of an alloy of previously selected metal materials and placed on the one surface of at least one busbar. The solder joint is changed from a molten state to a solid state to thereby mechanically and electrically connect an electronic component to the one surface of the at least one busbar. The at least one previously selected metal material of the at least one busbar and the previously selected metal materials of the alloy of the solder joint determine that a contact angle of the molten solder joint to the one surface of the at least one busbar is within an angular range of 40 to 60 degrees.

Abstract: An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.

Abstract: An electronic device mounting structure includes a printed circuit board, a busbar, and an electronic device mounted on the busbar. The busbar includes a parallel portion extending parallel to the printed circuit board and a bent portion extending from the parallel portion toward the printed circuit board. The bent portion of the busbar includes a first bent portion, a second bent portion, and a tip portion A thickness direction of the first bent portion is substantially parallel to a length direction of the parallel portion A thickness direction of the second bent portion is substantially parallel to a width direction of the parallel portion. The tip portion stands substantially at a right angle with respect to the second bent portion and is soldered to the printed circuit board.

Abstract: An electronic device mounting structure includes an electronic device, a busbar, and a solder. The electronic device has a body and a lead protruding from the body. The busbar has a flat portion and a wall portion rising from a periphery of the flat portion. The flat portion of the busbar extends parallel to a tip portion of the lead and is in contact with a back surface of the tip portion. The wall portion of the busbar faces a side surface of the tip portion with a predetermined space.

Abstract: In an electronic apparatus, a busbar assembly is composed of busbars made of at least one previously selected metal material. Each of the busbars has one surface. A solder joint is made of an alloy of previously selected metal materials and placed on the one surface of at least one busbar. The solder joint is changed from a molten state to a solid state to thereby mechanically and electrically connect an electronic component to the one surface of the at least one busbar. The at least one previously selected metal material of the at least one busbar and the previously selected metal materials of the alloy of the solder joint determine that a contact angle of the molten solder joint to the one surface of the at least one busbar is within an angular range of 40 to 60 degrees.

Abstract: Wiring members such as bus bars for electrically connecting electronic components are contained in a casing composed of a substrate and a cover for closing an opening of the substrate. A laser beam is irradiated on and around solder held in one of the wiring members through a laser-transparent portion formed in the cover of the casing. The solder is melted by energy of the laser beam, and the wiring members are electrically connected by the molten solder. The electronic components and wiring members may be encapsulated in the casing before or after the laser beam is irradiated. Since the laser beam is irradiated from outside the casing after the electronic components and wiring members are contained in the casing, they can be positioned in the casing with greater freedom.

Abstract: An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.

Abstract: A commutator is composed of a contact unit, a base member made of insulation material and a terminal unit. The contact unit has a flat brush-contact surface and a connection surface opposite the brush contact surface. The contact unit also has a plurality of commutator segments. The terminal unit has a plurality of conductive terminal members. The base member supports the commutator segments. The commutator also has an electrical connection structure having a set of a convex member and a concave member and a plurality of connection members disposed between the convex member and the concave member to connect the plurality of the commutator segments and terminal members respectively.

Abstract: An improved displacement control valve incorporated in a variable displacement compressor. The control valve includes a valve body and a solenoid for actuating the valve body. The coil of the solenoid is wound about a bobbin made of insulating synthetic resin. A base plate integrally protrudes from the bobbin. A pair of conducting plates are secured to the base plate. Each plate has a clamping block. The coil has a pair of terminal wires. Each terminal wire is secured to and electrically corrected to one of the clamping blocks. Each terminal wire is wound about a holder formed in each plate between the bobbin and the corresponding clamping block. A diode is secured to the holders and is connected in parallel with the coil. A pair of terminals of the diode are secured to the corresponding holders by soldering and crimping. The holders prevent tension in the terminal wires from being applied to electrical joints formed between the wires and the clamping blocks, which makes the valve more reliable.