Abstract: The present invention relates to a technique of dramatically improving a method for causing a molten metal of an Al alloy or the like to infiltrate without pressurization into a preform obtained by molding and hardening a ceramic powder, and obtaining “a metal matrix composite formed from a ceramic powder and an Al alloy or the like” in a uniform state as a whole more simply and stably, and the present invention provides “a production method for producing a metal matrix composite containing aluminum and ceramic, the method including: obtaining a mixed body by performing molding using a mixture containing a magnesium-containing powder, a ceramic powder, and an inorganic or organic/inorganic binder that is hardened when heated to 500° C. or lower; preparing a preform by calcining the mixed body at a temperature of 500° C.

Abstract: A piezo-electric oscillator has a reduced manufacturing cost using a general purpose piezo-electric vibrator, while coping with miniaturization. The piezo-electric oscillator has resin; a substrate having an upper face, a bottom face, a conductive terminal portion, and a mounting terminal portion at the bottom face; and a piezo-electric vibrator including a package, a conductive portion, a cover plate, a piezo-electric vibration piece, an external terminal portion; and an oscillation circuit element having an oscillation circuit. The piezo-electric vibration piece is housed within the package and, the package is fixed to the upper face of the substrate and sealed with the cover plate. The external terminal portion at a surface of the package is electrically coupled with the piezo-electric vibration piece and, at least the conductive portion excluding the mounting terminal portion is sealed with the resin. The oscillation circuit element is fixed to a face of the package opposite to the substrate.

Abstract: A piezo-electric oscillator has a reduced manufacturing cost using a general purpose piezo-electric vibrator, while coping with miniaturization. The piezo-electric oscillator has resin; a substrate having an upper face, a bottom face, a conductive terminal portion, and a mounting terminal portion at the bottom face; and a piezo-electric vibrator including a package, a conductive portion, a cover plate, a piezo-electric vibration piece, an external terminal portion; and an oscillation circuit element having an oscillation circuit. The piezo-electric vibration piece is housed within the package and, the package is fixed to the upper face of the substrate and sealed with the cover plate. The external terminal portion at a surface of the package is electrically coupled with the piezo-electric vibration piece and, at least the conductive portion excluding the mounting terminal portion is sealed with the resin. The oscillation circuit element is fixed to a face of the package opposite to the substrate.

Abstract: In a digital temperature compensated crystal oscillator, ADC circuit and DAC circuit are combined into a data conversion circuit which comprises a first section for DA conversion, a second section for converting an analog temperature voltage signal into a digital form in cooperation with the first section, and a third section for supplementing the DA conversion of the first section and thereby generating an analog control voltage for a VCO from a digital temperature compensation data. There is further provided a switch circuit for connecting the output of the first section to either of the second and third section.

Abstract: A digital control system such as a digital temperature compensated crystal oscillator (DTCXO) system is arranged to offer superior oscillating performance with reduced size and cost. For example, to reduce the memory capacity, a memory 31 receives upper 6 bits of temperature data, and a decoder 32 calculates temperature compensation data from lower 4 bits and output data from the memory (FIGS. 1-11). For a one-chip configuration and low power consumption, a MOS type Colpitts oscillator (FIG. 16) is provided with a circuit for adjusting the source resistance of the MOS. For size reduction and fine frequency adjustment, a DTCXO is provided with sections such as an adder 341, an up-down counter 342 and an auxiliary frequency control section (AFC) 332 (FIGS. 20, 21, 24 and 25). An adding section 415 is provided between a D/A converting section 414 and a capacitance varying section 416 to obtain superior linearity with respect to a control voltage and quality of offset.