Patents by Inventor Mutsuo Ishinoda

Mutsuo Ishinoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for sticking a tape onto a semiconductor wafer and method of sticking the tape
    Patent number: 6698488
    Abstract: The apparatus for sticking a tape onto a semiconductor wafer comprises a winding tape roll for winding a tape wound around a tape roll, a taper roller having a diameter which is tapered or reduced toward both ends thereof, a wafer table mounting thereon a semiconductor wafer which is taken out from a wafer carrier station and positioning the wafer thereon, an orientation flat cutter and a circumferential cutter.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: March 2, 2004
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Mutsuo Ishinoda
  • Apparatus for sticking a tape onto a semiconductor wafer and method of sticking the tape
    Publication number: 20020056523
    Abstract: The apparatus for sticking a tape onto a semiconductor wafer comprises a winding tape roll for winding a tape wound around a tape roll, a taper roller having a diameter which is tapered or reduced toward both ends thereof, a wafer table mounting thereon a semiconductor wafer which is taken out from a wafer carrier station and positioning the wafer thereon, an orientation flat cutter and a circumferential cutter.
    Type: Application
    Filed: October 12, 2001
    Publication date: May 16, 2002
    Inventor: Mutsuo Ishinoda