Abstract: An optical communication arrangement and method is disclosed which utilizes a combination of leadframe and package molding technology to reduce the complexity of the arrangement. In general, a leadframe is utilized for the placement and connection of the required electronic circuitry. An optical device is also coupled to the leadframe, where a subassembly may be used to house the optical device. The electronics and optics are then simultaneously encapsulated in a molded outer package to form the final arrangement. In one embodiment, an optical subassembly incorporating a fiber optic connector receptacle may be utilized, wherein the molded outer package is configured such that the connector receptacle remains exposed. Aternatively, the molded outer package may be configured to include the connector receptacle.

Abstract: An optical communication arrangement is disclosed which utilizes a combination of leadframe and package molding technology to reduce the complexity of the arrangement. In general, a leadframe is utilized for the placement and connection of the required electronic circuitry. A first molding operation is then performed to encapsulate the electronics. If necessary, a metallic plate may then be attached to the housed electronics to provide EMI shielding. An optical device is then coupled to the leadframe, where a separate subassembly may be used to house the optical device. The encapsulated electronics and optics are then simultaneously covered during a second molding operation to form the final package. In one embodiment, an optical subassembly incorporating a connector receptacle may be utilized, where the second molding operation is performed such that the connector receptacle remains exposed. Alternatively, the molded outer package may be configured to include the connector receptacle.

Abstract: A package arrangement is disclosed which utilizes a multi-layer ceramic (MLC) component subassembly member which extends beyond the periphery of the package sidewalls. The MLC member constains a number of bondpad sites formed on its inner layers to provide for the connection of leads to the package, where the leads do not have to penetrate the package sidewalls. This aspect of the package thus provides improved hermeticity over prior art designs. A metallic base plate is attached to the underside of the MLC and is electrically connected to metallic sidewalls to provide EMI and mechanical protection. The package may be utilized for housing either electronic or optoelectronic components.