Abstract: An apparatus for testing ball grid arrays (“BGAs”) is provided. The apparatus includes, a socket slot in a printed circuit board for holding a socket used for testing the BGAs; and plural holding members that support BGA solder balls. The socket top may have plural prong like holding members; plural circular holding members; and/or plural spiral holding members for supporting the solder balls. The holding members may be etched on a BGA socket top and are flexible, rigid and/or semi-rigid to provide support for the solder balls.

Abstract: A method and apparatus for reworking a Ball Grid Array (BGA) package is provided. The apparatus includes a housing with a solder ball compartment that includes solder balls; a sliding base plate positioned to slide under the solder ball compartment; and a BGA nest for supporting the BGA package and a stencil with a hole. The sliding base plate has a BGA nest holder adapted to receive the BGA nest with the BGA package and the stencil. The sliding base plate with the BGA nest, BGA package and the stencil moves underneath the solder ball compartment such that solder balls are placed on the BGA package through the stencil hole pattern. After the solder balls are placed on the BGA package, the sliding plate with the BGA package and the solder balls move in a second direction away from the solder ball compartment.