Patents by Inventor My Nguyen
My Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20070164424Abstract: Components and materials, including thermal transfer materials, contemplated herein comprise at least one heat spreader component, at least one thermal interface material and in some contemplated embodiments at least one adhesive material. The heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material. The thermal interface material is directly deposited onto at least part of the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one thermal interface material, wherein the thermal interface material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one thermal interface material onto the bottom surface of the heat spreader component.Type: ApplicationFiled: March 31, 2004Publication date: July 19, 2007Inventors: Nancy Dean, Richard Townsend, Paula Knoll, Colin Edie, My Nguyen, Dan Curran, Ignatius Rasiah
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Publication number: 20070098971Abstract: Layered interlace materials described herein comprise at least one crosslinkable thermal interface component and at least one compliant fibrous interface component coupled to the thermal interface component. A method of forming layered interface materials comprises: a) providing a crosslinkable thermal interface component; b) providing a compliant fibrous interface component; and c) physically coupling the thermal interface component and the compliant fibrous interface component. At least one additional layer, including a substrate layer, can be coupled to the layered interface material.Type: ApplicationFiled: May 30, 2002Publication date: May 3, 2007Inventors: My Nguyen, Nancy Dean, Kenishiro Fukuyama
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Publication number: 20060275698Abstract: Described herein are novel thermally reactive near-infrared absorbing acetal copolymers that undergo chemical and physical changes upon exposure to near-infrared radiation. Also described are the methods of preparation of the novel acetal copolymers starting either with vinyl-alcohol polymers or with acetal copolymers. Also described are the methods of use of the new near-infrared absorbing acetal copolymers in coatings used in lithographic offset printing plates that can be directly imaged with near-infrared laser imaging devices in computer-to-plate and digital offset printing technologies. The novel acetal copolymers are also useful in photoresist applications, rapid prototyping of printed circuit boards and chemical sensor development.Type: ApplicationFiled: June 1, 2006Publication date: December 7, 2006Inventors: My Nguyen, Marc Locas
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Publication number: 20060186348Abstract: A method, apparatus and system for analysing and authenticating a luminescent tag are provided wherein a luminescence is triggered in the tag and relative light intensities emitted thereby measured within at least two luminescence bands. The measured intensities are compared with at least one reference tag representative of relative intensities emitted by an authentic tag to determine whether the luminescent tag corresponds with any of the at least one reference tag. If the measured intensities match the representative intensities, the luminescent tag is authenticated. A computer program to be implemented by the apparatus and system is also disclosed. Further, a method and system for verifying the authenticity of one or plural objects are disclosed, wherein each of the objects is to be associated with a respective tag. The respective tags are coded to emit light, when triggered, within at least two luminescence bands at respective predetermined relative light intensities.Type: ApplicationFiled: February 17, 2006Publication date: August 24, 2006Inventors: Brian Nguyen, Duc-Huy Giang, My Nguyen
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Publication number: 20060057364Abstract: A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or “soft gel”. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material is needed to change some of the physical properties of the composition.Type: ApplicationFiled: June 20, 2005Publication date: March 16, 2006Inventor: My Nguyen
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Publication number: 20060040112Abstract: Layered thermal components described herein include at least one thermal interface component and at least one heat spreader component coupled to the thermal interface component. A method of forming layered thermal components disclosed herein comprises: a) providing at least one thermal interface component; b) providing at least one heat spreader component; and c) physically coupling the at least one thermal interface component and the at least one heat spreader component. At least one additional layer, including a substrate layer, can be coupled to the layered thermal component.Type: ApplicationFiled: July 15, 2003Publication date: February 23, 2006Inventors: Nancy Dean, Richard Townsend, Paula Knoll, Colin Edie, My Nguyen, Dan Curran
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Patent number: 6992397Abstract: A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex with the phosphorous residue from the electroless nickel plating process that is mixable with the Pb/Sn solder. The phosphorous containing compound or complex prevents degradation of the solder/under bump metallization bond associated with phosphorus residue. The interfacial solder/under bump metallization bond is thereby strengthened. This results in fewer fractured solder bonds and greater package reliability.Type: GrantFiled: February 9, 2004Date of Patent: January 31, 2006Assignee: Altera CorporationInventor: My Nguyen
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Publication number: 20050103424Abstract: Described herein are a method for recording luminescent compositions, comprising a) providing a luminescent composition which comprises at least a first and second luminescent compound, wherein the first luminescent compound is a donor compound having a peak luminescent emission spectrum at a given wavelength, wherein the second luminescent compound is an acceptor compound having a peak absorption spectrum at a longer wavelength than the given wavelength, and wherein the emission spectrum of the donor compound at least partially overlaps the absorption spectrum of the acceptor compound; b) combining the composition with a substrate, so that at least a portion of the composition is available for exposure to a photon source; and c) embedding information at predetermined sites in the combined composition by localized exposure to a photon source, the embedding resulting in an information pattern when exposed to a luminescence deciphering device, and uses of said information pattern.Type: ApplicationFiled: September 10, 2004Publication date: May 19, 2005Inventors: My Nguyen, Marc-Andre Locas, Pierre Brunner, Jean-Francois Fortin, Chuanyong Ji
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Patent number: 6797382Abstract: A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or “soft gel”. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material and/or at least one solvent is needed to change some of the physical properties of the composition.Type: GrantFiled: September 9, 2002Date of Patent: September 28, 2004Assignee: Honeywell International Inc.Inventors: My Nguyen, Kim-Chi Le
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Patent number: 6756687Abstract: A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex with the phosphorous residue from the electroless nickel plating process that is mixable with the Pb/Sn solder. The phosphorous containing compound or complex prevents degradation of the solder/under bump metallization bond associated with phosphorus residue. The interfacial solder/under bump metallization bond is thereby strengthened. This results in fewer fractured solder bonds and greater package reliability.Type: GrantFiled: March 5, 2003Date of Patent: June 29, 2004Assignee: Altera CorporationInventor: My Nguyen
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Patent number: 6706219Abstract: An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature.Type: GrantFiled: May 7, 2001Date of Patent: March 16, 2004Assignee: Honeywell International Inc.Inventor: My Nguyen
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Patent number: 6673434Abstract: A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or “soft gel”. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material is needed to change some of the physical properties of the composition.Type: GrantFiled: January 14, 2002Date of Patent: January 6, 2004Assignee: Honeywell International, Inc.Inventor: My Nguyen
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Patent number: 6605238Abstract: Described is a compliant and crosslinkable thermal interface material of at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler, and a method of making and using same; as well as a method of improving thermal conductivity of polymer and resin systems.Type: GrantFiled: January 30, 2001Date of Patent: August 12, 2003Assignee: Honeywell International Inc.Inventors: My Nguyen, James Grundy, Carl Edwards
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Publication number: 20030068487Abstract: A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or “soft gel”. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material and/or at least one solvent is needed to change some of the physical properties of the composition.Type: ApplicationFiled: September 9, 2002Publication date: April 10, 2003Inventors: My Nguyen, Kim-Chi Le
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Publication number: 20020132896Abstract: A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or “soft gel”. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material is needed to change some of the physical properties of the composition.Type: ApplicationFiled: January 14, 2002Publication date: September 19, 2002Inventor: My Nguyen
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Publication number: 20020007035Abstract: Described is a compliant and crosslinkable thermal interface material of at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler, and a method of making and using same; as well as a method of improving thermal conductivity of polymer and resin systems.Type: ApplicationFiled: January 30, 2001Publication date: January 17, 2002Inventors: My Nguyen, James Grundy, Carl Edwards
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Publication number: 20010038093Abstract: An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature.Type: ApplicationFiled: May 7, 2001Publication date: November 8, 2001Applicant: Honeywell International Inc.Inventor: My Nguyen