Patents by Inventor My Nhu Nguyen

My Nhu Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
    Patent number: 11416046
    Abstract: Provided herein are compositions made from a matrix and encapsulated phase change material particles dispersed therein, and electronic devices assembled therewith.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: August 16, 2022
    Assignee: Henkel AG & Co. KGaA
    Inventor: My Nhu Nguyen
  • COMPOSITIONS HAVING A MATRIX AND A HYDRATED SALT OF AN ACID AND A GROUP I OR II ELMENT OF THE PERIODIC TABLE DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH
    Publication number: 20170322600
    Abstract: Provided herein are compositions made from a matrix and a hydrated salt of an acid and a Group I or II element of the Periodic Table, and electronic devices assembled therewith.
    Type: Application
    Filed: May 5, 2017
    Publication date: November 9, 2017
    Inventors: My Nhu Nguyen, Qiaohong Huang, Uta Sundermeier
  • COMPOSITIONS HAVING A MATRIX AND ENCAPSULATED PHASE CHANGE MATERIALS DISPERSED THEREIN, AND ELECTRONIC DEVICES ASSEMBLED THEREWITH
    Publication number: 20170131751
    Abstract: Provided herein are compositions made from a matrix and encapsulated phase change material particles dispersed therein, and electronic devices assembled therewith.
    Type: Application
    Filed: November 5, 2015
    Publication date: May 11, 2017
    Inventor: My Nhu Nguyen
  • Electronic devices assembled with thermally insulating layers
    Patent number: 9209104
    Abstract: Provided herein are electronic devices assembled with thermally insulating layers.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: December 8, 2015
    Assignee: Henkel IP & Holding GmbH
    Inventors: My Nhu Nguyen, Jason Brandi
  • Electronic devices assembled with thermally insulating layers
    Patent number: 9209105
    Abstract: Provided herein are electronic devices assembled with thermally insulating layers.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: December 8, 2015
    Assignee: Henkel IP & Holding GmbH
    Inventors: My Nhu Nguyen, Emilie Barriau, Martin Renkel, Matthew J. Holloway, Jason Brandi
  • ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS
    Publication number: 20140239481
    Abstract: Provided herein are electronic devices assembled with thermally insulating layers.
    Type: Application
    Filed: May 1, 2014
    Publication date: August 28, 2014
    Applicants: Henkel IP & Holding GmbH, Henkel AG & Co. KGaA
    Inventors: My Nhu Nguyen, Emilie Barriau, Martin Renkel, Matthew J. Holloway, Jason Brandi
  • ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS
    Publication number: 20140239480
    Abstract: Provided herein are electronic devices assembled with thermally insulating layers.
    Type: Application
    Filed: May 1, 2014
    Publication date: August 28, 2014
    Applicant: Henkel lP & Holding GmbH
    Inventors: My Nhu Nguyen, Jason Brandi
  • Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
    Patent number: 8698320
    Abstract: This invention relates to thermosetting resin compositions useful for flip chip (“FC”) underfill sealant materials, where a semiconductor chip is mounted directly onto a circuit through solder electrical interconnections. Similarly, the compositions are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: April 15, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: My Nhu Nguyen, Puwei Liu
  • Thermal interface material with epoxidized nutshell oil
    Patent number: 8648460
    Abstract: A thermal interface material comprises an epoxy resin derived from nutshell oil or an epoxidized dimer fatty acid, or both, and fusible metal particles substantially devoid of added lead. Optionally, the TIM comprises a catalyst for the epoxy functionality.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: February 11, 2014
    Assignee: Henkel US IP LLC
    Inventors: My Nhu Nguyen, Chew Beng Chan
  • THERMAL INTERFACE MATERIAL WITH PHENYL ESTER
    Publication number: 20120279697
    Abstract: A thermal interface material comprises a phenyl ester and a thermally conductive filler. The material optionally contains an epoxy resin derived from nutshell oil or an epoxidized dimer fatty acid.
    Type: Application
    Filed: May 11, 2012
    Publication date: November 8, 2012
    Inventors: Deborah Forray, My Nhu Nguyen
  • Thermal Interface Material with Epoxidized Nutshell Oil
    Publication number: 20120187556
    Abstract: A thermal interface material comprises an epoxy resin derived from nutshell oil or an epoxidized dimer fatty acid, or both, and fusible metal particles substantially devoid of added lead. Optionally, the TIM comprises a catalyst for the epoxy functionality.
    Type: Application
    Filed: April 4, 2012
    Publication date: July 26, 2012
    Inventors: My Nhu Nguyen, Chew Beng Chan
  • CURABLE RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS FOR USE WITH LOW-K DIELECTRIC-CONTAINING SEMICONDUCTOR DEVICES
    Publication number: 20110133344
    Abstract: This invention relates to thermosetting resin compositions useful for flip chip (“FC”) underfill sealant materials, where a semiconductor chip is mounted directly onto a circuit through solder electrical interconnections. Similarly, the compositions are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate.
    Type: Application
    Filed: December 7, 2009
    Publication date: June 9, 2011
    Applicant: Henkel Corporation
    Inventors: My Nhu Nguyen, Puwei Liu