Abstract: Embodiments provide a lighting apparatus including a light source unit including a first light source and a second light source, a light source driving unit including a first driver configured to supply first supply current to the first light source and a second driver configured to supply second supply current to the second light source, and a controller configured to control the first driver so as to vary the level of the first supply current and to control the second driver so as to fix the level of the second supply current.

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (Al2O3) groups classified by particle size.

Abstract: An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.

Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina (Al2O3).

Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains alumina (Al2O3) and boron nitride (BN).

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes alumina (Al2O3) and aluminum nitride (AlN).

Abstract: Embodiments provide a lighting apparatus including a light source unit including a first light source and a second light source, a light source driving unit including a first driver configured to supply first supply current to the first light source and a second driver configured to supply second supply current to the second light source, and a controller configured to control the first driver so as to vary the level of the first supply current and to control the second driver so as to fix the level of the second supply current.

Abstract: A hot press sintering apparatus according to the embodiment includes a chamber; a mold member located in the chamber and including a mold space section to be filled with a raw material; a press member for pressing and processing the raw material in the mold member; and a heating member for heating an interior of the chamber. The mold member includes a first mold part and a second mold part inserted into the first mold part and formed with the mold space section.

Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains spherical alumina (Al2O3).

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises: a resin including an epoxy compound, triethylenediamine, diphenylphosphine and/or tetraphenylborate; a curing agent including diaminodiphenylsulfone, ethylenediamine, diaminopropane, methanediamine, phenylenediamine and/or triethanolamine; and an inorganic filler, wherein the inorganic filler includes at least two alumina (Al2O3) groups classified by particle size.

Abstract: According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes alumina (Al2O3) and aluminum nitride (AlN).

Abstract: The epoxy resin composition according to one embodiment of the present invention contains an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler contains alumina (Al2O3) and boron nitride (BN).

Abstract: An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler.

Abstract: There are provided a coil component and a method of manufacturing the same. The coil component includes a core; at least one bobbin coupled to the core and having a coil wound therearound; and a base having the core seated therein and including an external connection terminal, wherein one side of the core is seated in the bobbin and the other side thereof is exposed to the outside of the base.

Abstract: There are provided a coil component and a method of manufacturing the same. The coil component includes a core; at least one bobbin coupled to the core and having a coil wound therearound; and a base having the core seated therein and including an external connection terminal, wherein one side of the core is seated in the bobbin and the other side thereof is exposed to the outside of the base.

Abstract: There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.

Abstract: A transformer capable of security insulting reliability and a power module having the same are provided. The transformer includes: a winding unit having at least one winding space in which a plurality of coils are wound in a stacked manner on an outer circumferential surface of a cylindrical body portion; and a terminal fastening unit formed to extend from one end of the winding unit in an outer diameter direction and having a plurality of external connection terminals fastened to an end thereof, wherein a width of the winding space is less than 0.45 times that of a diameter of the body portion.

Abstract: There is provided a coil component in which a plurality of coils may be easily connected to external connection terminals. The coil component includes: a bobbin including a winding part having a coil wound therearound and a terminal connection part having at least one external connection terminal connected thereto, the external connection terminal having a lead wire of the coil connected thereto; and at least one auxiliary terminal part coupled to the terminal connection part to allow for an increase in an amount of the external connection terminal.

Abstract: A method for manufacturing a silicon carbide (SiC) sintered material according to the embodiment includes the steps of forming a mixture by mixing SiC powder with a resin and a ball; drying the mixture; and loading the dried mixture in a mold to sinter the dried mixture. The ball includes at least one of a Teflon ball, an SiC ball, a silicon nitride ball, an alumina ball, and a zirconia ball.