Abstract: A method of treating a surface of a printed circuit board (PCB) for a chip on board (COB) integrated circuit (IC) card includes generating a flexible copper foil laminated film by laminating copper foils on opposite sides of an insulating layer, forming a circuit pattern layer on opposite sides of the flexible copper foil laminated film, laminating nickel through electroplating on the opposite sides of the flexible copper foil laminated film having formed thereon the circuit pattern layer, and electroplating a copper-tin (CuSn) compound layer on a contact side on which the flexible copper foil laminated film having electroplated thereon nickel is exposed to outside.

Abstract: Provided is a memory controller configured to control data sanitization. The memory controller includes a sanitization information storing unit configured to store first information or second information in a non-volatile manner, and a control unit configured to store the first information in the sanitization information storing unit when sanitization of data stored in a non-volatile memory has completed in response to a sanitization command of a host and store the second information in the sanitization information storing unit in response to a write command of the host.