Abstract: The present invention provides a tip for a writing instrument includes: a tip main body; a ball seat formed at the front end of the tip main body, communicated with the ink channel, and having a chamfer on the inner side thereof; a ball retained with a portion exposed, in the ball seat; and an elastic member disposed in the ink channel of the tip main body and always applying force to the ball in the exposure direction, in order to keep the tip clean and achieve a smooth line by preventing ink from remaining at the front end of the tip.

Abstract: In order that pressure is always applied to a center part of a ball and ink flows smoothly, a ballpoint pen tip according to an exemplary embodiment of the invention includes: a ball that has a diameter of 0.

Abstract: A carrier structure has an inside member formed of a plastic material, an outer member formed of steel coupled to the inside member, and a bracket formed at a lower end of the outer member for reducing the weight of the carrier. The bracket is coupled to the inner member at a portion for mounting a radiator by an over-molding method, thereby enhancing the mounting strength of a cooling system.

Abstract: A fixing structure for a head lamp module of an automobile comprises the head lamp module, a bracket, and a clip. The head lamp module, configured to be coupled to the font surface of a carrier of the automobile, has a fixing panel piece integrally formed at an upper position thereof to be fixed at the carrier, and a pair of rearward-protruding semi-circular loops defining fitting bores, respectively. The bracket has a pair of rectangular holes which allow the loops of the head lamp module to pass there through, so as to position the fitting bores in front of the bracket, and a pair of bolt holes, which allow the bracket to be bolted to the front surface of the carrier. The clip is configured to be inserted downward through the fitting bores of the loops passed though the holes of the bracket, so as to allow the head lamp module to be mounted to the front surface of the carrier via the bracket.

Abstract: A fixing structure for a head lamp module of an automobile comprises the head lamp module, a bracket, and a clip. The head lamp module, configured to be coupled to the font surface of a carrier of the automobile, has a fixing panel piece integrally formed at an upper position thereof to be fixed at the carrier, and a pair of rearward-protruding semi-circular loops defining fitting bores, respectively. The bracket has a pair of rectangular holes which allow the loops of the head lamp module to pass there through, so as to position the fitting bores in front of the bracket, and a pair of bolt holes, which allow the bracket to be bolted to the front surface of the carrier. The clip is configured to be inserted downward through the fitting bores of the loops passed though the holes of the bracket, so as to allow the head lamp module to be mounted to the front surface of the carrier via the bracket.

Abstract: A carrier structure has an inside member formed of a plastic material, an outer member formed of steel coupled to the inside member, and a bracket formed at a lower end of the outer member for reducing the weight of the carrier. The bracket is coupled to the inner member at a portion for mounting a radiator by an over-molding method, thereby enhancing the mounting strength of a cooling system.

Abstract: A bottom lead semiconductor package includes a plurality of bottom leads with inner leads extended upwardly bent or inclined from corresponding ones of the bottom leads. A semiconductor chip is attached to an upper surface of each of the bottom leads by a nonconductive adhesive, and a plurality of conductive wires electrically connects a plurality of chip pads on the chip to the inner leads. A molding compound forms a package body having a plurality of openings such that a lower surface of each of the bottom leads is externally exposed. The fabrication method includes a molding step for sealingly molding the package but exposing the lower surface of the bottom leads and the inner leads upwardly bent extending from corresponding ones of the bottom leads. A mold with a plurality of protrusions on a bottom surface in the mold and the protrusions respectively serve to fill openings formed below each of the inner leads to prevent the flow of molding resin into the openings.