Abstract: Methods and apparatus for finishing an edge of a glass sheet are described. The edge of the glass sheet is finished using two grinding wheels mounted on spindles so that the edge of the grinding wheels chamfer the edge of the glass sheet during relative movement of the grinding wheels and the glass sheet.

Abstract: A method of symmetrically chamfering a substrate includes repeating, at least a plurality of times, the steps of chamfering an edge of the substrate using a chamfering wheel, measuring an asymmetric chamfering deviation (y) of the edge of the substrate which is chamfered, and controlling a relative position of the chamfering wheel with respect to the substrate by a value of a function f(y) of the variable y. It is possible to constantly symmetrically chamfer the edge of the substrate via active response to a change in the chamfering environment without a hardware-based operation of the related art.

Abstract: A method of measuring a flatness of a chamfering table includes the steps of positioning a substrate on the chamfering table, chamfering an edge of the substrate a plurality of times with a chamfering wheel while varying a relative height of the chamfering wheel with respect to a height of the substrate, locating symmetric chamfered points where the chamfered edge is top-bottom symmetric, matching values of the relative height of the chamfering wheel to the found symmetric chamfered points, and obtaining the flatness of the chamfering table from the values of the relative height of the chamfering wheel that are matched to the symmetric chamfered points.

Abstract: A method of measuring a flatness of a chamfering table includes the steps of positioning a substrate on the chamfering table, chamfering an edge of the substrate a plurality of times with a chamfering wheel while varying a relative height of the chamfering wheel with respect to a height of the substrate, locating symmetric chamfered points where the chamfered edge is top-bottom symmetric, matching values of the relative height of the chamfering wheel to the found symmetric chamfered points, and obtaining the flatness of the chamfering table from the values of the relative height of the chamfering wheel that are matched to the symmetric chamfered points.

Abstract: A method of symmetrically chamfering a substrate includes repeating, at least a plurality of times, the steps of chamfering an edge of the substrate using a chamfering wheel, measuring an asymmetric chamfering deviation (y) of the edge of the substrate which is chamfered, and controlling a relative position of the chamfering wheel with respect to the substrate by a value of a function f(y) of the variable y. It is possible to constantly symmetrically chamfer the edge of the substrate via active response to a change in the chamfering environment without a hardware-based operation of the related art.