Patents by Inventor Myeong Hak YANG

Myeong Hak YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting diode
    Patent number: 11296258
    Abstract: A light emitting diode includes a first conductivity type semiconductor layer and a mesa disposed on the first conductivity type semiconductor layer wherein the mesa is a semiconductor stack including an active layer and a second conductivity type semiconductor layer; a ZnO layer disposed on the second conductivity type semiconductor layer; a lower insulation layer covering the ZnO layer and the mesa, and including an opening exposing the ZnO layer; a first pad metal layer disposed on the lower insulation layer, and electrically connected to the first conductivity type semiconductor layer; a second pad metal layer electrically connected to the ZnO layer through the opening of the lower insulation layer, and an upper insulation layer covering the first pad metal layer and the second pad metal layer.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: April 5, 2022
    Assignee: SEOUL VIOSYS CO., LTD.
    Inventors: Seom Geun Lee, Chan Seob Shin, Myeong Hak Yang, Jin Woong Lee
  • LIGHT-EMITTING DIODE
    Publication number: 20200176641
    Abstract: A light emitting diode includes a first conductivity type semiconductor layer and a mesa disposed on the first conductivity type semiconductor layer wherein the mesa is a semiconductor stack including an active layer and a second conductivity type semiconductor layer; a ZnO layer disposed on the second conductivity type semiconductor layer; a lower insulation layer covering the ZnO layer and the mesa, and including an opening exposing the ZnO layer; a first pad metal layer disposed on the lower insulation layer, and electrically connected to the first conductivity type semiconductor layer; a second pad metal layer electrically connected to the ZnO layer through the opening of the lower insulation layer, and an upper insulation layer covering the first pad metal layer and the second pad metal layer.
    Type: Application
    Filed: December 6, 2019
    Publication date: June 4, 2020
    Applicant: SEOUL VIOSYS CO., LTD.
    Inventors: Seom Geun LEE, Chan Seob SHIN, Myeong Hak YANG, Jin Woong LEE