Patents by Inventor Mykhailo Tymchenko
Mykhailo Tymchenko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240111094Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: December 1, 2023Publication date: April 4, 2024Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20240103219Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: December 1, 2023Publication date: March 28, 2024Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Patent number: 11860413Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: GrantFiled: November 29, 2022Date of Patent: January 2, 2024Assignee: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20230408764Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: August 24, 2023Publication date: December 21, 2023Applicant: Lightmatter, Inc.Inventors: NICHOLAS C. HARRIS, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20230400632Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: August 24, 2023Publication date: December 14, 2023Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20230388024Abstract: Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.Type: ApplicationFiled: March 27, 2023Publication date: November 30, 2023Applicant: Lightmatter, Inc.Inventors: Mykhailo Tymchenko, Bradford Turcott, Robert Turner, Binoy Shah, Shashank Gupta, James Carr, Ajay Joshi, Nicholas C. Harris, Darius Bunandar
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Publication number: 20230358957Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: July 21, 2023Publication date: November 9, 2023Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20230314742Abstract: Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.Type: ApplicationFiled: March 27, 2023Publication date: October 5, 2023Applicant: Lightmattter, Inc.Inventors: Carlos Dorta-Quinones, Mykhailo Tymchenko, Anthony Kopa, Michael Gould, Bradford Turcott, Robert Turner, Reza Baghdadi, Shashank Gupta, Ajay Joshi, Nicholas C. Harris, Darius Bunandar
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Patent number: 11754783Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: GrantFiled: May 6, 2021Date of Patent: September 12, 2023Assignee: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20230114847Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: November 29, 2022Publication date: April 13, 2023Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20210278590Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: May 6, 2021Publication date: September 9, 2021Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Patent number: 11036002Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: GrantFiled: March 5, 2020Date of Patent: June 15, 2021Assignee: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20210157211Abstract: The techniques described herein relate to methods and apparatus for interferometric modulation. An apparatus includes an interferometric device comprising a first optical path and a second optical path, and at least one Franz-Keldysh (FK) modulator disposed in either the first optical path or the second optical path of the interferometric device. The interferometric device receives input light, wherein a first portion of the input light travels along the first optical path of the interferometric device, and a second portion of the input light travels along the second optical path of the interferometric device. The FK modulator modulates an intensity of either the first portion of the input light or the second portion of the input light.Type: ApplicationFiled: November 19, 2020Publication date: May 27, 2021Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Michael Gould, Mykhailo Tymchenko, Weilu Gao, Shashank Gupta
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Publication number: 20200284981Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: March 5, 2020Publication date: September 10, 2020Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Patent number: 9733545Abstract: A nonlinear metasurface structure including a multi-quantum-well layer designed for a nonlinear response for a desired nonlinear optical process and an array of nanoantennas coupled to the intersubband transitions of the multi-quantum-well layer. Each nanoantenna in the array is designed to have electromagnetic resonances at or close to all input and output frequencies of a given nonlinear optical process. Nanoantennas allow efficient coupling of any incident and outgoing light polarizations to intersubband transitions. Nanoantennas may further provide significant field enhancement in the multi-quantum-well layer. As a result, the nonlinear metasurface structure can be designed to produce a highly nonlinear response for any polarization and angle of incidence of incoming and outgoing waves in a nonlinear optical process. Due to their very larger nonlinear response, efficient frequency conversion can be produced in these metasurfaces without the stringent phase-matching constraints of bulk nonlinear crystals.Type: GrantFiled: July 30, 2015Date of Patent: August 15, 2017Assignee: Board of Regents, The University of Texas SystemInventors: Mikhail Belkin, Andrea Alu, Jongwon Lee, Mykhailo Tymchenko
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Publication number: 20170097558Abstract: A nonlinear metasurface structure including a multi-quantum-well layer designed for a nonlinear response for a desired nonlinear optical process and an array of nanoantennas coupled to the intersubband transitions of the multi-quantum-well layer. Each nanoantenna in the array is designed to have electromagnetic resonances at or close to all input and output frequencies of a given nonlinear optical process. Nanoantennas allow efficient coupling of any incident and outgoing light polarizations to intersubband transitions. Nanoantennas may further provide significant field enhancement in the multi-quantum-well layer. As a result, the nonlinear metasurface structure can be designed to produce a highly nonlinear response for any polarization and angle of incidence of incoming and outgoing waves in a nonlinear optical process. Due to their very larger nonlinear response, efficient frequency conversion can be produced in these metasurfaces without the stringent phase-matching constraints of bulk nonlinear crystals.Type: ApplicationFiled: July 30, 2015Publication date: April 6, 2017Inventors: Mikhail Belkin, Andrea Alu, Jongwon Lee, Mykhailo Tymchenko