Patents by Inventor Myles Koshiol

Myles Koshiol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Temperature sensor attachment facilitating thermal conductivity to a measurement point and insulation from a surrounding environment
    Patent number: 8905635
    Abstract: A temperature sensor package includes a temperature sensor having a first side and a second side, wherein the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement of an object. The temperature sensor package further includes a circuit board having a first side and a second side, the first side of the circuit board coupled to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: December 9, 2014
    Assignee: Honeywell International Inc.
    Inventors: Matthew Clark, Terry Dean Stark, George Goblish, Myles Koshiol
  • Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board
    Patent number: 8901432
    Abstract: An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: December 2, 2014
    Assignee: Honeywell International Inc.
    Inventors: Matthew Clark, Craig A. Galbrecht, George Goblish, Myles Koshiol
  • TEMPERATURE SENSOR ATTACHMENT FACILITATING THERMAL CONDUCTIVITY TO A MEASUREMENT POINT AND INSULATION FROM A SURROUNDING ENVIRONMENT
    Publication number: 20130083326
    Abstract: A temperature sensor package includes a temperature sensor having a first side and a second side, wherein the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement of an object. The temperature sensor package further includes a circuit board having a first side and a second side, the first side of the circuit board coupled to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Matthew Clark, Terry Dean Stark, George Goblish, Myles Koshiol
  • MITIGATION OF BLOCK BENDING IN A RING LASER GYROSCOPE CAUSED BY THERMAL EXPANSION OR COMPRESSION OF A CIRCUIT BOARD
    Publication number: 20130081860
    Abstract: An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.
    Type: Application
    Filed: September 30, 2011
    Publication date: April 4, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Matthew Clark, Craig A. Galbrecht, George Goblish, Myles Koshiol
  • Three-dimensional printed circuit board
    Patent number: 7919717
    Abstract: A three-dimensional PWB is provided that may include two or more layers stacked together forming a top surface, a bottom surface, and one or more side surfaces, and one or more solder pad situated on at least one of the one or more side surfaces. The one or more solder pads may include exposed voids in the one or more side surfaces. In some cases, the top surface and/or the bottom surface may have one or more solder pad. The one or more solder pads on at least one of the one or more side surfaces may be electrically connected to the one or more solder pads on the top surface and/or the bottom surface. In the illustrative PWB, the top surface and/or the bottom surface may be adapted to be mounted with an inertial sensor. The one or more side surfaces may be adapted to be mounted to a printed wiring board.
    Type: Grant
    Filed: August 19, 2005
    Date of Patent: April 5, 2011
    Assignee: Honeywell International Inc.
    Inventors: Todd L. Braman, Myles A. Koshiol
  • THREE-DIMENSIONAL PRINTED CIRCUIT BOARD
    Publication number: 20070062727
    Abstract: A three-dimensional PWB is provided that may include two or more layers stacked together forming a top surface, a bottom surface, and one or more side surfaces, and one or more solder pad situated on at least one of the one or more side surfaces. The one or more solder pads may include exposed voids in the one or more side surfaces. In some cases, the top surface and/or the bottom surface may have one or more solder pad. The one or more solder pads on at least one of the one or more side surfaces may be electrically connected to the one or more solder pads on the top surface and/or the bottom surface. In the illustrative PWB, the top surface and/or the bottom surface may be adapted to be mounted with an inertial sensor. The one or more side surfaces may be adapted to be mounted to a printed wiring board.
    Type: Application
    Filed: August 19, 2005
    Publication date: March 22, 2007
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Todd Braman, Myles Koshiol