Patents by Inventor Myo Paing

Myo Paing has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optoelectronic modules including optoelectronic device subassemblies and methods of manufacturing the same
    Patent number: 10510932
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Grant
    Filed: February 14, 2019
    Date of Patent: December 17, 2019
    Assignee: AMS SENSORS SINGAPORE PTE. LTD.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • OPTOELECTRONIC MODULES INCLUDING OPTOELECTRONIC DEVICE SUBASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20190214533
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Application
    Filed: February 14, 2019
    Publication date: July 11, 2019
    Applicant: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • Optoelectronic device subassemblies and methods of manufacturing the same
    Patent number: 10243111
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: March 26, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee
  • OPTOELECTRONIC MODULES INCLUDING OPTOELECTRONIC DEVICE SUBASSEMBLIES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20180006192
    Abstract: The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
    Type: Application
    Filed: June 23, 2017
    Publication date: January 4, 2018
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Hartmut Rudmann, Qichuan Yu, Simon Gubser, Bojan Tesanovic, Xu Yi, Eunice Ho Hui Ong, Hongyuan Liu, Ji Wang, Edmund Koon Tian Lua, Myo Paing, Jian Tang, Ming Jie Lee