Patents by Inventor Myong Hwan PARK

Myong Hwan PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING THE SAME
    Publication number: 20240138075
    Abstract: The present invention relates to a release layer for a metal foil with carrier and a metal foil with carrier including the release layer. The release layer is designed for easy removal of the carrier and includes one or more nitrogenous heterocyclic compounds and one or more inorganic compounds containing at least one metal selected from the group consisting of nickel, molybdenum, cobalt, phosphorus, manganese, and iron.
    Type: Application
    Filed: December 10, 2021
    Publication date: April 25, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Myong Hwan PARK, Nak Eun KO, Ju Young SIM
  • METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CIRCUIT BOARD COMPRISING SAME
    Publication number: 20240015885
    Abstract: The present invention relates to a metal foil having a rough surface, a carrier-attached metal foil including the metal foil, and a printed circuit board manufactured using the metal foil. The rough surface is naturally formed during formation of the metal foil. The formation of the rough surface allows the metal foil to have a high adhesive strength to an insulating resin substrate and enables the manufacture of a printed circuit board with improved efficiency.
    Type: Application
    Filed: December 10, 2021
    Publication date: January 11, 2024
    Inventors: Sung Wook CHUN, Bo Mook CHUNG, Dea Geun KIM, Myong Hwan PARK, Nak Eun KO, Ju Yong SIM