Patents by Inventor Myong Jo HAM

Myong Jo HAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230374302
    Abstract: A thermoplastic resin composition including 100 parts by weight of a base resin including 50-95% by weight of a polyarylene ether resin (a-1) and 5-50% by weight of a polystyrene resin (a-2); 8.5-16 parts by weight of two or more types of organophosphorus flame retardants (b) having different phosphorus contents; 0.5-3 parts by weight of organoclay (c); 0.5-3.5 parts by weight of pulverized mica (d); 1-4 parts by weight of an alkaline earth metal sulfate (e); and 1-5 parts by weight of a polyfunctional reactant (f), a method of preparing the thermoplastic resin composition, and a molded article including the thermoplastic resin composition. The thermoplastic resin composition has excellent mechanical properties, such as impact strength and tensile strength, heat resistance, electrical insulation, and flame retardancy.
    Type: Application
    Filed: July 21, 2021
    Publication date: November 23, 2023
    Inventors: Gi Dae CHOI, Hyuntae KIM, Myong Jo HAM, Hyeseung HAM, Jinseon KIM
  • Patent number: 11623988
    Abstract: A polyphenylene sulfide resin composition including (a) 25% to 75% by weight of a base resin; (b) 0.1% to 10% by weight of a laser direct structuring (LDS) additive; (c) 0.1% to 5% by weight of a plating seed generation promoter; (d) 10% to 60% by weight of a glass fiber; and (e) 0% to 40% by weight of a mineral filler, based on a total weight of the polyphenylene sulfide resin composition. The base resin includes 95% by weight or more of a polyphenylene sulfide resin based on a total weight of the base resin. A method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: April 11, 2023
    Assignee: LG CHEM, LTD.
    Inventors: Hyun Jin Lee, Myong Jo Ham, Soongin Kim, Eon Seok Lee
  • Publication number: 20220356343
    Abstract: A conductive resin composition including 100 parts by weight of a base resin (A), which includes a polyester, a polyarylene ether, and an aromatic elastomer; 3 to 12 parts by weight of two or more polyfunctional reaction agents (B); 0.1 to 3 parts by weight of carbon nanotubes (C); 0.1 to 5 parts by weight of carbon nanoplates (D); and 1 to 10 parts by weight of glass powder (E), a method of preparing the conductive resin composition, and a molded article including the conductive resin composition. The conductive resin composition has excellent moisture stability and heat resistance in addition to excellent appearance, rigidity, and conductivity; can minimize the influence of moisture and heat when exposed to external environments; and thus, can be used in exterior parts to replace metal parts used in automobiles.
    Type: Application
    Filed: July 8, 2021
    Publication date: November 10, 2022
    Inventors: Gi Dae Choi, Jinseon Kim, Myong Jo Ham, Hyun Jin Lee
  • Publication number: 20220002544
    Abstract: Disclosed is a heat insulating material composition including crosslinked polyarylene sulfide and glass fiber. The heat insulating material composition according to an embodiment of the present disclosure can realize excellent insulation performance and has excellent impact resistance and support performance, even when provided in a thin thickness. Accordingly, the heat insulating material composition according to an embodiment of the present disclosure can be applied usefully to electronic products, such as a refrigerator, requiring an adiabatic body.
    Type: Application
    Filed: October 23, 2020
    Publication date: January 6, 2022
    Inventors: Ran Hee LEE, Soong In KIM, Myong Jo HAM
  • Publication number: 20210403682
    Abstract: The present disclosure relates to a thermoplastic resin composition including a thermoplastic resin, carbon fiber, carbon nanotube, plate-shaped graphite, and metal fiber, which has excellent mechanical properties and electromagnetic wave shielding performance.
    Type: Application
    Filed: October 28, 2020
    Publication date: December 30, 2021
    Inventors: Gi Dae CHOI, Young Joo KIM, Myong Jo HAM, Oh Min KWON
  • Publication number: 20210221954
    Abstract: A method is provided for preparing a low temperature thermosetting polyarylene sulfide having significantly low crystallinity while maintaining a low melt flow rate at a high polymerization yield, so as to ensure excellent laser welding property and mechanical properties even when used in a molded product on the transmitting side of laser beam by a laser welding method.
    Type: Application
    Filed: October 25, 2019
    Publication date: July 22, 2021
    Inventors: Myeongjin Ha, Joong Jin Han, Eunju Park, Sung Ho Lee, Myong Jo Ham, Jeongbin Lee, Youngseok Kim
  • Publication number: 20200369884
    Abstract: A polyphenylene sulfide resin composition including (a) 25% to 75% by weight of a base resin; (b) 0.1% to 10% by weight of a laser direct structuring (LDS) additive; (c) 0.1% to 5% by weight of a plating seed generation promoter; (d) 10% to 60% by weight of a glass fiber; and (e) 0% to 40% by weight of a mineral filler, based on a total weight of the polyphenylene sulfide resin composition. The base resin includes 95% by weight or more of a polyphenylene sulfide resin based on a total weight of the base resin. A method of preparing the polyphenylene sulfide resin composition, and an injection-molded article manufactured using the polyphenylene sulfide resin composition.
    Type: Application
    Filed: November 14, 2019
    Publication date: November 26, 2020
    Inventors: Hyun Jin LEE, Myong Jo HAM, Soongin KIM, Eon Seok LEE
  • Patent number: 10065860
    Abstract: The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: September 4, 2018
    Assignee: LG Chem, Ltd.
    Inventors: Kwon Il Choi, Myong Jo Ham, Eon Seok Lee, Cheol-Hee Park, Han Nah Jeong, Jae Hyun Kim, Shin Hee Jun, Eun Kyu Seong
  • Publication number: 20170267526
    Abstract: The present invention relates to a composition for forming conductive patterns and a resin structure having a conductive pattern, capable of forming a conductive micropattern on various polymer resin products or resin layers using a simplified process and exhibiting excellent heat dissipation characteristics. The composition for forming conductive patterns comprises: a polymer resin; a non-conductive metal compound represented by a specific chemical formula; and a heat-dissipating material, wherein a metal nucleus is formed from the non-conductive metal compound by the irradiation of electromagnetic waves.
    Type: Application
    Filed: September 17, 2015
    Publication date: September 21, 2017
    Inventors: Kwon Il CHOI, Myong Jo HAM, Eon Seok LEE, Cheol-Hee PARK, Han Nah JEONG, Jae Hyun KIM, Shin Hee JUN, Eun Kyu SEONG