Abstract: Disclosed is a novel piperidinedione compound of Formula 1 or a pharmaceutically acceptable salt thereof. Uses of the novel piperidinedione compound of Formula 1 or a pharmaceutically acceptable salt thereof as an anti-tumor agent or an immunomodulatory for treatment of CRBN protein-mediated diseases are disclosed. Also the compound or salt thereof can be used an E3 ligase binder in a PROTAC compound comprising a protein of interest ligand, a linker and an E3 ligase binder.

Abstract: The present invention relates to a pickering emulsion composition using polyimide particles and a method for preparing the same. The pickering emulsion stabilized by the polyimide particles according to the present invention has a very stable dispersed phase and does not cause flocculation, creaming, coalescence and phase separation even after a long time, and has an advantage of being capable of forming both an oil-in-water type emulsion and a water-in-oil type emulsion. Further, the polyimide particles used in the present invention can be synthesized in a simple manner and have partial wettability without the surface treatment and pH control so that they can be easily used for the emulsion stabilization.

Abstract: The present invention relates to a pickering emulsion composition using polyimide particles and a method for preparing the same. The pickering emulsion stabilized by the polyimide particles according to the present invention has a very stable dispersed phase and does not cause flocculation, creaming, coalescence and phase separation even after a long time, and has an advantage of being capable of forming both an oil-in-water type emulsion and a water-in-oil type emulsion. Further, the polyimide particles used in the present invention can be synthesized in a simple manner and have partial wettability without the surface treatment and pH control so that they can be easily used for the emulsion stabilization.

Abstract: Disclosed herein is a floor system for efficiently absorbing an impact applied to a floor. The floor system includes a first impact-absorbing material, and a second impact-absorbing material installed at an upper side of the first impact-absorbing material and having a higher density than that of the first impact-absorbing material.

Abstract: Disclosed herein is a floor sound-insulating type heating system in which a floor sound-insulating structure for reducing the transmission of an impact sound from upstairs to downstairs in an apartment complex and a dry floor heating structure are integrally formed with each other. The floor sound-insulating type heating system can achieve improvements in construction efficiency as well as sound insulation and heat insulation effects.

Abstract: The present invention relates to an insole for footwear adapted to be received into a variety of footwear, the insole including: upper and lower plates made of a synthetic resin film and joined to each other by means of high-frequency bonding; a chamber formed between the upper and lower plates and having a shock-absorbing compression member embedded thereinto in such a manner as to be located at the rear side of the footwear upon the wearing of the footwear; air-introducing means adapted to communicate with the chamber in such a manner as to be located at the front side of the footwear upon the wearing of the footwear so as to introduce the internal air of the footwear to the chamber; and air-exhausting means adapted to communicate with the chamber so as to exhaust the air introduced to the chamber to the outside.

Abstract: A recording medium and apparatus and method for managing defective areas are discussed. According to an embodiment a controller determining whether or not to replace a defective block with a replacement block when a writing or reading data to or from the optical recording medium, based upon a data type to be written or read, and creating a defect list, the defect list including information to indicate whether or not the defective block is replaced with a replacement block; and a writing reading unit, coupled to the controller, to write or read the data to or from the optical recording medium and storing the defect list to a defect management area of the optical recording medium, according to a control of the controller.

Abstract: The present invention relates to a recording medium and apparatus and method for managing a defective area of the recording medium. According to an embodiment, the method includes (a) determining whether there is an available replacement block in a spare area and a found defective block is controlled by a linear replacement algorithm; (b) managing a defective data block based on the determination, such that the defective data block is replaced with the replacement block of the spare area if there is the available replacement block and the found defective data block is controlled by the linear replacement algorithm; and (c) recording a defect list to the recording medium, wherein the defect list includes first position information specifying the location of defective data block, second position information specifying the location of replacement block and identification information specifying that the defective data block is replaced.

Abstract: Disclosed herein is a floor sound-insulating type heating system in which a floor sound-insulating structure for reducing the transmission of an impact sound from upstairs to downstairs in an apartment complex and a dry floor heating structure are integrally formed with each other. The floor sound-insulating type heating system can achieve improvements in construction efficiency as well as sound insulation and heat insulation effects.

Abstract: Disclosed herein is a floor system for efficiently absorbing an impact applied to a floor. The floor system includes a first impact-absorbing material, and a second impact-absorbing material installed at an upper side of the first impact-absorbing material and having a higher density than that of the first impact-absorbing material.

Abstract: An apparatus for injecting plasma in the atmosphere is provided, including a plurality of dielectric panels (13a, 13b, 13c), and 13d, which are disposed in parallel at predetermined intervals, a gas supply portion (14), to which the dielectric panels (13a, 13b, 13c, and 13d) are fixed and which supplies a gas to spaces between the dielectric panels (13a and 13b), between the dielectric panels (13b and 13c), and between the dielectric panels (13c and 13d), power electrodes (15a, 15b, and 15c), which are linearly installed near the gas supply portion (14) and between the dielectric panels (13a and 13b, between the dielectric panels 13b and 13c, and between the dielectric panels 13c and 13d), respectively, ground electrodes (16a, 16b, 16c, and 16d), which are formed in the ends of the dielectric panels (13a, 13b, 13c, and 13d), respectively, and a high frequency generator (17), which applies high frequency power to the power electrodes (15a, 15b, and 15c) and the ground electrodes (16a, 16b, 16c, and 16d).

Abstract: A defect area management system for an optical storage medium including a management part producing a defect area management signal for real-time processing and transmitting the signal along with data to be written; and a write part executing a defect area management of the optical storage media, writing the data, applied by the defect area management signal from the management part, into the optical storage medium so that whenever a light pickup meets a defect block at the time of writing data requiring the real-time processing into the optical storage medium, it does not have to be moved to the spare area, thus reducing the time it takes to move the light pickup and removing shortcomings of the real-time processing.

Abstract: A defect area management system for an optical storage medium including a management part producing a defect area management signal for real-time processing and transmitting the signal along with data to be written; and a write part executing a defect area management of the optical storage media, writing the data, applied by the defect area management signal from the management part, into the optical storage medium so that whenever a light pickup meets a defect block at the time of writing data requiring the real-time processing into the optical storage medium, it does not have to be moved to the spare area, thus reducing the time it takes to move the light pickup and removing shortcomings of the real-time processing.

Abstract: Disclosed are apparatus and methods of chemical mechanical polishing a semiconductor wafer to minimize formation of scratches on a surface of a wafer. According to one example, a method of planarizing a pattern of a wafer by rotating the wafer that is fixed to a carrier head, on a polishing pad by pressing the wafer against the polishing pad and injecting slurry onto the polishing pad is disclosed. The method may include performing a first planarization process by injecting the slurry onto the polishing pad and rotating the wafer as the wafer contacts the polishing pad and performing a second planarization process during which the wafer is spaced apart from the polishing pad at a given spacing, wherein air is injected into the polishing pad to produce bubbles in the slurry on the polishing pad while the wafer is rotated.

Abstract: Disclosed are apparatus and methods of chemical mechanical polishing a semiconductor wafer to minimize formation of scratches on a surface of a wafer. According to one example, a method of planarizing a pattern of a wafer by rotating the wafer that is fixed to a carrier head, on a polishing pad by pressing the wafer against the polishing pad and injecting slurry onto the polishing pad is disclosed. The method may include performing a first planarization process by injecting the slurry onto the polishing pad and rotating the wafer as the wafer contacts the polishing pad and performing a second planarization process during which the wafer is spaced apart from the polishing pad at a given spacing, wherein air is injected into the polishing pad to produce bubbles in the slurry on the polishing pad while the wafer is rotated.

Abstract: A dry surface cleaning apparatus removes surface contaminants on a surface of a workpiece. The dry surface cleaning apparatus has a laser for generating a laser beam, a sealed chamber for holding the workpiece therein, wherein the sealed chamber has a transparent window through which the laser beam is transmitted, and a laser focusing lens for converging the laser beam on a laser focus around the surface of the workpiece to generate a plasma shock wave around the laser focus.

Abstract: A dry surface cleaning apparatus removes surface contaminants on a surface of a workpiece. The dry surface cleaning apparatus includes a laser for generating a laser beam, a beam delivery control unit for splitting the laser beam into a first and a second laser beam, a frequency modulator for modulating the second laser beam to generate a shorter wavelength laser beam and a laser focusing lens for converging the first laser beam on a laser focus around the surface of the workpiece to generate a plasma shock wave around the laser focus.

Abstract: A dry surface cleaning apparatus removes surface contaminants on a surface of a workpiece. The dry surface cleaning apparatus has a laser for generating a laser beam, a sealed chamber for holding the workpiece therein, wherein the sealed chamber has a transparent window through which the laser beam is transmitted, and a laser focusing lens for converging the laser beam on a laser focus around the surface of the workpiece to generate a plasma shock wave around the laser focus.

Abstract: A dry surface cleaning apparatus removes surface contaminants on a surface of a workpiece. The dry surface cleaning apparatus includes a laser for generating a laser beam, a beam delivery control unit for splitting the laser beam into a first and a second laser beam, a frequency modulator for modulating the second laser beam to generate a shorter wavelength laser beam and a laser focusing lens for converging the first laser beam on a laser focus around the surface of the workpiece to generate a plasma shock wave around the laser focus.

Abstract: A mold set for encapsulating semiconductor chips on lead frame strips with a molding compound supplied in tablets, includes a pot where molding compound tablets are loaded and pressed to form a fluid molding compound (FMC), and a main runner connected to the pot, through which the FMC passes from the pot. A plurality of sub-runners are connected to the main runner and are oriented substantially radially from a center region of the main runner. Each sub-runner has a proximal end, where it joins the main runner, and a distal end. A plurality of cavities are disposed on both sides of the main runner. Each of the plurality of cavities is in flow to communication with the distal end of a respective one of the plurality of sub-runners. The present invention allows the FMC to be introduced into all cavities at nearly the same time and at nearly a constant velocity.