Abstract: A data receiving device may include a dummy stage block. The dummy stage block may include m dummy stages, wherein m is a natural number greater than or equal to two. Each of the m dummy stages may be configured to remove inter-symbol interference (ISI) from a dummy input signal using dummy coefficient information to generate a dummy output signal free of the ISI. Each of the m dummy stages may be further configured to output the dummy output signal. A normal stage block may include n normal stages, wherein n is a natural number greater than or equal to two. Each of the n normal stages may be configured to remove ISI from an input signal using coefficient information to generate an output signal free of the ISI and may be further configured to output the output signal.

Abstract: A semiconductor LED package includes a package body having first and second electrode structures and an LED chip connected to at least one of the first and second electrode structures using a wire. The LED chip includes a light emitting structure and first and second electrode parts. At least one of the first and second electrode parts includes a bonding electrode layer made of a material having the same composition as a material of the wire and bonded to the wire, and an uneven electrode layer disposed on the bonding electrode layer and having at least one through hole filled with the wire. The at least one through hole allows a top surface of the bonding electrode layer to be exposed therebelow.

Abstract: A light emitting device package may include a package body; first and second lead frames; and a support part disposed below the first and second lead frames and having a region overlapping with at least a portion of a space formed between the first and second lead frames, the support part containing a material different from that of the package body.

Abstract: A light emitting device package includes a frame unit including at least two lead frames spaced apart from one another and a light emitting region defined by a distance between the two lead frames; a light emitting device mounted on a surface of the frame unit such that the light emitting device is positioned across the light emitting region, and electrically connected to the lead frames; a wavelength conversion unit provided in the light emitting region, and configured to convert a wavelength of light emitted from the light emitting device and emit the light having the converted wavelength; and a reflective molding unit formed on the surface of the frame unit to cover the light emitting device.

Abstract: A semiconductor LED package includes a package body having first and second electrode structures and an LED chip connected to at least one of the first and second electrode structures using a wire. The LED chip includes a light emitting structure and first and second electrode parts. At least one of the first and second electrode parts includes a bonding electrode layer made of a material having the same composition as a material of the wire and bonded to the wire, and an uneven electrode layer disposed on the bonding electrode layer and having at least one through hole filled with the wire. The at least one through hole allows a top surface of the bonding electrode layer to be exposed therebelow.

Abstract: A light emitting device package includes a frame unit including at least two lead frames spaced apart from one another and a light emitting region defined by a distance between the two lead frames; a light emitting device mounted on a surface of the frame unit such that the light emitting device is positioned across the light emitting region, and electrically connected to the lead frames; a wavelength conversion unit provided in the light emitting region, and configured to convert a wavelength of light emitted from the light emitting device and emit the light having the converted wavelength; and a reflective molding unit formed on the surface of the frame unit to cover the light emitting device.

Abstract: In an LCD backlight unit using a light emitting diode, a double-sided printed circuit board includes a plurality of divided areas and conductive vias. A plurality of light emitting diodes are disposed on a top surface of the double-sided printed circuit board. A plurality of driving circuit connectors are disposed at a portion of the double-sided printed circuit board. A plurality of first lead patterns are formed on the top surface of the printed circuit board, each of the first lead patterns electrically connecting the light emitting diodes in each of the divided areas with one another. Also, a plurality of second lead patterns are formed on an underside surface of the double-sided printed circuit board to electrically connect the first lead patterns with the connectors through the conductive vias.

Abstract: A backlight unit suitable for realizing a high-quality image. The backlight unit according to the present invention is a direct type, which is disposed under a liquid crystal panel to irradiate light to a back surface of the liquid crystal panel. The backlight unit includes a light source unit having a plurality of light source regions formed on a substrate, each of the light source regions driven separately and having at least one light emitting diode. The backlight unit also includes partitions provided on the substrate and disposed between the light source regions of the light source unit, and a circuit for controlling and driving the light source unit.

Abstract: In an LCD backlight unit using a light emitting diode, a double-sided printed circuit board includes a plurality of divided areas and conductive vias. A plurality of light emitting diodes are disposed on a top surface of the double-sided printed circuit board. A plurality of driving circuit connectors are disposed at a portion of the double-sided printed circuit board. A plurality of first lead patterns are formed on the top surface of the printed circuit board, each of the first lead patterns electrically connecting the light emitting diodes in each of the divided areas with one another. Also, a plurality of second lead patterns are formed on an underside surface of the double-sided printed circuit board to electrically connect the first lead patterns with the connectors through the conductive vias.