Patents by Inventor Myoung Bok Kim

Myoung Bok Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Filler metal alloy compositions
    Patent number: 7988908
    Abstract: Provided is a filler metal alloy composition capable of improving appearance of a welded zone and fluidity, penetration, etc., of an inexpensive filler metal by minimizing a content of silver (Ag) and adding tin (Sn) and silicon (Si) components. The filler metal alloy composition, brazed to a joint between parent metals to stably join the parent metals formed of the same material or different materials, is characterized in that the composition comprises silver (Ag), copper (Cu), zinc (Zn), tin (Sn), silicon (Si), and other unavoidable impurities.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: August 2, 2011
    Assignee: Korea Bundy Co., Ltd.
    Inventors: Dong Ha Lee, Jae Jung Park, Chung Yun Kang, Myoung Bok Kim
  • FILLER METAL ALLOY COMPOSITIONS
    Publication number: 20110058980
    Abstract: Provided is a filler metal alloy composition capable of improving appearance of a welded zone and fluidity, penetration, etc., of an inexpensive filler metal by minimizing a content of silver (Ag) and adding tin (Sn) and silicon (Si) components. The filler metal alloy composition, brazed to a joint between parent metals to stably join the parent metals formed of the same material or different materials, is characterized in that the composition comprises silver (Ag), copper (Cu), zinc (Zn), tin (Sn), silicon (Si), and other unavoidable impurities.
    Type: Application
    Filed: February 22, 2010
    Publication date: March 10, 2011
    Inventors: Dong Ha Lee, Jae Jung Park, Chung Yun Kang, Myoung Bok Kim