Patents by Inventor Myoung Bok Kim

Myoung Bok Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cathode active material for lithium secondary battery and method of manufacturing the same
    Patent number: 11978893
    Abstract: A cathode active material for a lithium secondary battery includes a lithium metal oxide particle and a thio-based compound formed on at least portion of a surface of the lithium metal oxide particle. The thio-based compound has a double bond that contains a sulfur atom. Chemical stability of the lithium metal oxide particle may be improved and surface residues may be reduced by the thio-based compound.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: May 7, 2024
    Assignee: SK ON CO., LTD.
    Inventors: Jik Soo Kim, Sang Bok Kim, Hyo Shin Kwak, Myoung Lae Kim, Se Rah Moon, Jin Seok Seo, Mi Jung Noh, Duck Chul Hwang
  • Filler metal alloy compositions
    Patent number: 7988908
    Abstract: Provided is a filler metal alloy composition capable of improving appearance of a welded zone and fluidity, penetration, etc., of an inexpensive filler metal by minimizing a content of silver (Ag) and adding tin (Sn) and silicon (Si) components. The filler metal alloy composition, brazed to a joint between parent metals to stably join the parent metals formed of the same material or different materials, is characterized in that the composition comprises silver (Ag), copper (Cu), zinc (Zn), tin (Sn), silicon (Si), and other unavoidable impurities.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: August 2, 2011
    Assignee: Korea Bundy Co., Ltd.
    Inventors: Dong Ha Lee, Jae Jung Park, Chung Yun Kang, Myoung Bok Kim
  • FILLER METAL ALLOY COMPOSITIONS
    Publication number: 20110058980
    Abstract: Provided is a filler metal alloy composition capable of improving appearance of a welded zone and fluidity, penetration, etc., of an inexpensive filler metal by minimizing a content of silver (Ag) and adding tin (Sn) and silicon (Si) components. The filler metal alloy composition, brazed to a joint between parent metals to stably join the parent metals formed of the same material or different materials, is characterized in that the composition comprises silver (Ag), copper (Cu), zinc (Zn), tin (Sn), silicon (Si), and other unavoidable impurities.
    Type: Application
    Filed: February 22, 2010
    Publication date: March 10, 2011
    Inventors: Dong Ha Lee, Jae Jung Park, Chung Yun Kang, Myoung Bok Kim