Abstract: A firing furnace includes a firing furnace main body having an internal passage from an inlet to an outlet, a first heating portion disposed in an upper portion of the internal passage, a second heating portion disposed in a central portion of the internal passage, a third heating portion disposed in a lower portion of the internal passage, a first transporting roller disposed between the first heating portion and the second heating portion, and a second transporting roller disposed between the second heating portion and the third heating portion. A distance between the first heating portion and the second heating portion is greater than a distance between the second heating portion and the third heating portion.

Abstract: A fan-out semiconductor package includes a core member having a through-hole; a semiconductor chip disposed in the through-hole of the core member and having an active surface on which connection pads are disposed and an inactive surface disposed to oppose the active surface; a heat radiating member directly bonded to the inactive surface of the semiconductor chip; an encapsulant encapsulating at least a portion of the semiconductor chip; and a connection member disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads of the semiconductor chip.