Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.

Abstract: The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.

Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without perfolining a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.

Abstract: An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.

Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.

Abstract: Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without performing a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs.

Abstract: The present invention provides a structure of a printed circuit board and a manufacturing method thereof. The method includes: (a) forming a circuit pattern on an insulating layer in which a seed layer is formed; (b) embedding the circuit pattern into the insulating layer by a press method; and (c) removing the seed layer. According to the present invention, a fine pattern may be formed without occurring alignment problem by forming a circuit pattern directly on an insulating layer and reliability of the formed fine pattern may be increased by performing a process of embedding protruded circuits into the insulating layer. In addition, possibility of inferior circuit occurring due to ion migration between adjacent circuits may be reduced by performing over-etching a circuit layer to be lower than a surface of the insulating layer during the etching process of removing a seed layer.

Abstract: A structure of a printed circuit board and a method of manufacturing the same are provided. The manufacturing method includes a first step of forming at least one connecting bump on first circuit patterns and forming a first insulating layer to form an inner circuit board, a second step of processing a second insulating layer with a metal seed layer formed thereon using a mold to form second circuit patterns so as to construct an outer circuit board, and a third step of aligning the inner circuit board and the outer circuit board with each other and laminating the inner circuit board and the outer circuit board. Accordingly, a structure of a high-density high-reliability printed circuit board having a circuit embedded in an insulating layer can be provided. A seed layer forming process for forming an outmost circuit can be removed by using an insulating layer combined with a seed layer.

Abstract: An embedded printed circuit board and a manufacturing method thereof are provided. The manufacturing method includes a first step of forming a first insulating layer having a seed layer formed on one side thereof and at least. one metal pattern embedded therein and a second step of laminating the first insulating layer and a base substrate with an inner circuit having a second insulating layer interposed between the first insulating layer and the base substrate. Accordingly, a printed circuit board with a circuit embedded in an insulating layer is provided, and thus a high-density and high-reliability printed circuit board can be achieved. Furthermore, since the printed circuit board is manufactured using a mold, a circuit manufacturing process for embedding, a process for forming a seed layer and a complicated process such as surface grinding are omitted so as to simplify the manufacturing process.

Abstract: An embedded PCB, a multi-layer PCB using the embedded PCB, and a method of manufacturing the same are provided. The method of manufacturing an embedded PCB includes a first step of patterning an insulating layer on which a photoresist layer is formed using a laser such that parts of the insulating layer are selectively etched to form a circuit pattern region and a second step of filling the circuit pattern region with a plating material to form a circuit pattern. Accordingly, the method of manufacturing an embedded PCB can simultaneously or sequentially etch a photoresist layer and an insulating layer using a laser to form a circuit pattern so as to obtain a micro pattern and simplify a manufacturing process and achieve alignment accuracy in construction of a multi-layer PCB using the embedded PCB to thereby improve product reliability and yield.