Abstract: A cliché of a gravure offset printing device is fabricated such that an organic layer and a photoresist layer are formed on a substrate. The photoresist layer is developed to form a photoresist pattern, and in a state that the organic layer is blocked with the photoresist pattern, the organic layer is etched to form a groove. The organic layer allows a fine process, so that a gravure offset printing device adopting the cliché can form a fine ink pattern. This fine pattern produces a resolution that is applicable to the production of semiconductors and liquid crystal display devices.

Abstract: A method for forming a pattern includes forming a resist pattern on a printing roll, printing a multi-stepped resist pattern on an etching object layer formed on a substrate by using the printing roll and etching the etching object layer by using the printed resist pattern as a mask.

Abstract: A cliché of a gravure offset printing device is fabricated such that an organic layer and a photoresist layer are formed on a substrate. The photoresist layer is developed to form a photoresist pattern, and in a state that the organic layer is blocked with the photoresist pattern, the organic layer is etched to form a groove. The organic layer allows a fine process, so that a gravure offset printing device adopting the cliché can form a fine ink pattern. This fine pattern produces a resolution that is applicable to the production of semiconductors and liquid crystal display devices.

Abstract: A method for providing a metal pattern forms a metal pattern of a display device or a semiconductor device. The method includes printing a conductive organic material such as poly 3,4-ethylenedioxythiophen (PEDOT) using a simple printing method such as an ink jet printing, a screen printing and a gravure printing method, where the printed material defines the metal pattern.

Abstract: A method for forming a pattern includes filling resist in a recess of a cliché corresponding to a position of a pattern to be formed, transferring the resist filled in the recess onto a surface of a transfer roll by rotating the transfer roll on the cliché, forming a resist pattern by rotating the transfer roll onto a process-subjected layer such that the transfer roll contacts the process-subjected layer of a substrate, ashing resist residuals from the substrate on which the resist pattern is formed using a plasma, and etching the process-subjected layer using one of dry etching and wet etching.

Abstract: A method for patterning includes filling ink in a recess of a cliché corresponding to a position of a pattern which will be formed, transferring the ink onto a surface of a transfer roll by rotating the transfer roll while the transfer roll is contacted to the cliché, detecting variation of the substrate by calculating the area of the substrate on which the ink is transferred, calculating moving speed of the substrate on a basis of the detected variation, and re-transferring the ink on the surface of the transfer roll onto the substrate by rotating the transfer roll when the transfer roll is contacted to the substrate while moving the substrate at the calculated moving speed.

Abstract: Disclosed is a method for forming a pattern of a LCD device using a printing process, in which additive for detachment corresponding to detachment accelerant is coated in a groove of a cliché filled with ink, thereby easily transferring ink to a layer to be processed. A surface of the layer to be processed is processed chemically or physically to enhance an adhesive force with the ink.